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TLC2652C-8DRG4

Texas Instruments

TLC2652C-8DRG4 by Texas Instruments

TLC2652C-8DRG4 by Texas Instruments is an Operational Amplifier with 140 dB CMRR, 1.5 V/us Slew Rate, and 4.35 uV Max Input Offset Voltage. Ideal for precision applications requiring low bias current and offset voltage in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,025 parts In-Stock

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Digiode

USA . 101 parts In-Stock

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101

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Parana Technologies

USA . 1,978 parts In-Stock

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$1.280

100+ parts

-

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$2.040

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$1.280

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$2.040

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DigiPath Technology Company

USA . 504 parts In-Stock

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$1.409

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504

$1.409

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IDEA Electronic Components Group

UK . 2,018 parts In-Stock

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$1.438

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$1.294

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2,018

$1.438

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$1.294

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ChromeModa Solutions

Germany . 842 parts In-Stock

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$1.438

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$1.179

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842

$1.438

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One Stop Electronics

USA . 1,259 parts In-Stock

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$4.410

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$4.410

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AZTECH Wire

Italy . 690 parts In-Stock

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$10.297

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$10.297

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Microchip USA

USA . 4,207 parts In-Stock

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Kepictronics

USA . 3,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,808 parts In-Stock

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Corphita

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Overview

Experience unparalleled performance and reliability with the TLC2652C-8DRG4 by Texas Instruments, a leading manufacturer in the industry. This operational amplifier is perfect for a wide range of applications, offering low-offset and low-bias features that ensure optimal precision and accuracy. With a compact design and high-quality materials, this product guarantees long-lasting durability and efficiency. Trust Texas Instruments to deliver cutting-edge technology that enhances your projects' performance and value. Upgrade your systems today with the TLC2652C-8DRG4 and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, suitable for a wide range of applications.

Maximum Input Offset Voltage: 4.35 uV

Provides accurate signal processing with minimal error.

Maximum Average Bias Current (IIB): 0.0001 uA

Low power consumption, ideal for battery-operated devices.

Surface Mount: YES

Easy to integrate onto PCBs, saving space and simplifying assembly processes.

Nominal Common Mode Reject Ratio: 140 dB

Effective rejection of common-mode signals for improved signal quality.

Nominal Supply Voltage / Vsup (V): 5

Standard supply voltage for compatibility with various systems.

Minimum Slew Rate: 1.5 V/us

Fast response time for rapid signal amplification.

Maximum Operating Temperature: 70 °C

Suitable for use in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Can operate in cold temperatures without issues.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high reliability.

Architecture: CHOPPER-STAB

Chopper-stabilized architecture for reduced offset voltage and improved stability.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2652C-8DRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Chooper Stab

Technology:

CMOS

Power Supply:

±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

1.9 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

140 dB

Minimum Common Mode Rejection Ratio (CMRR ):

120 dB

Input Offset Voltage Limit:

4.35 uV

Minimum Voltage Gain:

1000000

Minimum Slew Rate:

1.5 V/us

Nominal Slew Rate:

2.8 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

100 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

2.4 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC2652C-8DRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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