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TLC2272AMDREPG4

Texas Instruments

TLC2272AMDREPG4 by Texas Instruments

TLC2272AMDREPG4 by Texas Instruments is a CMOS Operational Amplifier with 2 functions, featuring low bias current of 0.00006 uA and max input offset voltage of 950 uV. Ideal for military-grade applications due to its temperature grade, it offers high common mode reject ratio and unity gain bandwidth of 2180 kHz.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,330 parts In-Stock

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Digiode

USA . 3,244 parts In-Stock

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Nova Conductors

Japan . 57 parts In-Stock

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Parana Technologies

USA . 2,106 parts In-Stock

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$2.234

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$2.737

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2,106

$2.234

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$2.737

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DigiPath Technology Company

USA . 1,329 parts In-Stock

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$2.460

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$2.460

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ChromeModa Solutions

Germany . 3,818 parts In-Stock

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$2.510

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$2.058

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IDEA Electronic Components Group

UK . 1,297 parts In-Stock

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$2.510

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$2.259

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One Stop Electronics

USA . 538 parts In-Stock

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$5.410

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538

$5.410

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Ampacity Inc.

Singapore . 940 parts In-Stock

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$6.410

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940

$6.410

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AZTECH Wire

Italy . 390 parts In-Stock

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$18.782

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QUARKTWIN TECHNOLOGY LTD

USA . 16,782 parts In-Stock

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Argo Parts USA

USA . 3,063 parts In-Stock

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Microchip USA

USA . 2,664 parts In-Stock

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Continental Prestige Electronics

USA . 2,013 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Experience top-tier performance and reliability with the TLC2272AMDREPG4 by Texas Instruments. As a leading manufacturer in operational amplifiers, Texas Instruments delivers superior quality and precision engineering in every product. Ideal for a wide range of applications, this op amp provides unmatched value and benefits to customers seeking high-performance solutions. Trust Texas Instruments to elevate your designs with the TLC2272AMDREPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the operational amplifier, making it suitable for a variety of applications.

Maximum Input Offset Voltage: 950 uV

The low maximum input offset voltage of 950uV ensures accurate and precise signal processing, making this operational amplifier reliable for sensitive measurements and control systems.

Maximum Average Bias Current (IIB): 0.0008 uA

The low maximum average bias current of 0.0008uA helps minimize power consumption and improve overall efficiency in the operation of the amplifier.

Surface Mount: YES

Being surface mountable makes the operational amplifier easy to integrate into circuit boards, thus simplifying the manufacturing process and saving space in the final product.

Nominal Common Mode Reject Ratio: 75 dB

The high nominal common mode reject ratio of 75dB allows the operational amplifier to effectively reject common mode noise and interference, resulting in cleaner and more accurate signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2272AMDREPG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.2/±8/4.4/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

2.18 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

75 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

950 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

1.7 V/us

Nominal Slew Rate:

3.6 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

800 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

3 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC2272AMDREPG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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