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TLC2254AQDRQ1

Texas Instruments

TLC2254AQDRQ1 by Texas Instruments

TLC2254AQDRQ1 by Texas Instruments is a CMOS Operational Amplifier with 4 functions, 1000 uV max input offset voltage, and 88 dB nominal CMRR. Ideal for automotive applications due to AEC-Q100 screening level, low bias current of 0.00006 uA, and micropower technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,679 parts In-Stock

1+ parts

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3,679

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Vyrian

USA . 2,387 parts In-Stock

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2,387

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,679 parts In-Stock

1+ parts

$1.662

100+ parts

-

1k+ parts

$2.270

10k+ parts

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1,679

$1.662

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$2.270

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DigiPath Technology Company

USA . 1,990 parts In-Stock

1+ parts

$1.830

100+ parts

$1.683

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-

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1,990

$1.830

$1.683

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ChromeModa Solutions

Germany . 4,851 parts In-Stock

1+ parts

$1.867

100+ parts

$1.531

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4,851

$1.867

$1.531

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IDEA Electronic Components Group

UK . 1,505 parts In-Stock

1+ parts

$1.867

100+ parts

-

1k+ parts

$1.680

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1,505

$1.867

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$1.680

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One Stop Electronics

USA . 563 parts In-Stock

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$3.410

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563

$3.410

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AZTECH Wire

Italy . 358 parts In-Stock

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$5.909

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358

$5.909

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QUARKTWIN TECHNOLOGY LTD

USA . 10,094 parts In-Stock

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10,094

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Corphita

USA . 487 parts In-Stock

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487

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Microchip USA

USA . 325 parts In-Stock

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325

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Overview

Experience exceptional performance and reliability with the TLC2254AQDRQ1 by Texas Instruments. As a leading manufacturer in operational amplifiers, Texas Instruments guarantees top-notch quality and precision engineering. This versatile component is perfect for various automotive applications, offering an unmatched combination of low power consumption and high common mode rejection ratio. With its micropower capabilities and wide operating temperature range, the TLC2254AQDRQ1 provides outstanding value and performance to meet your demanding requirements. Trust Texas Instruments for superior solutions in operational amplifier technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the inner components of the operational amplifier, ensuring long-term reliability.

Maximum Input Offset Voltage: 1000 uV

Low input offset voltage helps in minimizing errors in signal processing, making this operational amplifier suitable for precision applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Unity Gain Bandwidth: 210 kHz

With a high unity gain bandwidth, this operational amplifier can accurately amplify signals across a wide frequency range, making it versatile for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high input impedance, making this operational amplifier suitable for battery-powered devices and high-impedance signal processing.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2254AQDRQ1 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

5/±5 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

210 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

88 dB

Input Offset Voltage Limit:

1000 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.12 V/us

Peak Bias Current:

60 pA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Maximum Supply Current:

300 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Screening Level:

AEC-Q100

Standards

JESD-30 Code:

R-PDSO-G14

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC2254AQDRQ1 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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