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TLC2254AIDRG4

Texas Instruments

TLC2254AIDRG4 by Texas Instruments

TLC2254AIDRG4 by Texas Instruments is a CMOS operational amplifier with 4 functions. It has a max input offset voltage of 1000 uV and a nominal common mode reject ratio of 83 dB. This amplifier is commonly used in automotive applications due to its low-bias and micropower features.

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Digiode

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650

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Parana Technologies

USA . 531 parts In-Stock

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$3.176

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531

$2.694

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DigiPath Technology Company

USA . 2,346 parts In-Stock

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$2.966

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ChromeModa Solutions

Germany . 4,455 parts In-Stock

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IDEA Electronic Components Group

UK . 1,332 parts In-Stock

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$3.027

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$2.724

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$2.724

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Ampacity Inc.

Singapore . 1,590 parts In-Stock

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$8.410

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One Stop Electronics

USA . 1,038 parts In-Stock

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AZTECH Wire

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$11.209

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Component Stockers USA

USA . 357 parts In-Stock

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Microchip USA

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Overview

Experience superior performance and precision with the TLC2254AIDRG4 by Texas Instruments. As a leading manufacturer, Texas Instruments ensures top-quality operational amplifiers (Op Amps) that meet the highest industry standards. The TLC2254AIDRG4 boasts four functions in a compact rectangular package, making it ideal for a range of applications. With a nominal common mode reject ratio of 83 dB and a minimum voltage gain of 10,000, this Op Amp delivers exceptional accuracy and reliability. Plus, its micropower technology and low-bias design make it energy-efficient and cost-effective. Trust Texas Instruments for all your operational amplifier needs and discover the difference today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The use of plastic/epoxy material ensures durability and lightweight, making it suitable for various applications.

Maximum Input Offset Voltage:

1000 uV - The low input offset voltage enhances precision and accuracy in signal amplification and processing.

Maximum Average Bias Current (IIB):

0.001 uA - This low bias current helps reduce power consumption and minimize signal distortion.

Surface Mount:

YES - The surface mount feature offers easy installation and integration into compact electronic circuits.

No. of Functions:

4 - With multiple functions, this op amp provides versatility and can be used in various systems and applications.

Package Shape:

RECTANGULAR - The rectangular shape facilitates easy mounting and PCB layout, saving space within electronic systems.

Nominal Common Mode Reject Ratio:

83 dB - The high common mode reject ratio improves the stability and accuracy of amplification in the presence of common mode signals.

Nominal Supply Voltage / Vsup (V):

5 - The nominal supply voltage of 5V ensures compatibility and easy integration with standard power sources.

Power Supplies (V):

+-2.2/+-8/4.4/16 - The multiple power supply options provide flexibility in designing and adapting the op amp to various voltage requirements.

No. of Terminals:

14 - The 14 terminals offer sufficient connectivity options and ease of connection in complex electronic systems.

Maximum Input Offset Current (IIO):

0.00006 uA - The low input offset current enhances precision and minimizes errors in signal amplification and processing.

Package Style (Meter):

SMALL OUTLINE - The small outline package style allows for space-efficient integration in compact electronic devices and systems.

Minimum Slew Rate:

0.05 V/us - The low slew rate ensures controlled and precise signal amplification while minimizing distortion and overshoot.

Maximum Supply Voltage Limit:

8 V - The maximum supply voltage limit provides protection against potential voltage spikes and ensures reliability.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature allows for reliable operation in various environments and applications.

Maximum Bias Current (IIB) @25°C:

0.00006 uA - The low bias current ensures minimal power consumption and reduces potential signal distortion.

Frequency Compensation:

YES - The presence of frequency compensation improves stability and prevents oscillations in the amplifier circuit.

Minimum Voltage Gain:

10000 - The high minimum voltage gain enables amplification of weak signals while maintaining signal integrity.

Minimum Operating Temperature:

40 °C - The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au) - The use of nickel, palladium, and gold terminal finish enhances conductivity and provides corrosion resistance, ensuring long-term reliability.

Terminal Position:

DUAL - The dual terminal position allows for easy and flexible connection options in various circuit layouts.

Maximum Seated Height:

1.75 mm - The low maximum seated height enables the op amp to fit in compact designs and thin applications.

Width:

3.9 mm - The narrow width contributes to space-saving integration and facilitates compact circuit design.

Micropower:

YES - The micropower feature allows for low power consumption, making it suitable for battery-powered applications.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature ensures reliable soldering during manufacturing and assembly processes.

Length:

8.65 mm - The moderate length provides flexibility in integrating the op amp into different electronic systems and modules.

Temperature Grade:

AUTOMOTIVE - The automotive temperature grade ensures reliable performance and operation under challenging automotive environments.

Low-Bias:

YES - The low-bias design minimizes power consumption and reduces potential signal distortion in various amplification applications.

Maximum Negative Supply Voltage Limit:

8 V - The maximum negative supply voltage limit protects the op amp from potential voltage spikes and ensures safe operation.

Nominal Unity Gain Bandwidth:

210 kHz - The high unity gain bandwidth enables accurate amplification of signals up to 210 kHz, making it suitable for various audio and communication applications.

Minimum Common Mode Reject Ratio:

70 dB - The high minimum common mode reject ratio improves the amplifier's ability to cancel out unwanted common mode signals, enhancing overall performance.

Technology:

CMOS - The CMOS technology offers low power consumption, high input impedance, and wide voltage swing, making it suitable for battery-operated and low-voltage applications.

Terminal Form:

GULL WING - The gull wing terminal form ensures secure soldering and robust connection during assembly, enhancing the overall mechanical reliability of the op amp.

Amplifier Type:

OPERATIONAL AMPLIFIER - This product being an operational amplifier provides excellent voltage amplification and precise signal processing capabilities.

Maximum Supply Current:

0.25 mA - The low maximum supply current ensures efficient power usage and reduces heat dissipation in electronic circuits.

Nominal Negative Supply Voltage (Vsup):

5 V - The nominal negative supply voltage of -5V ensures compatibility and ease of integration with standard power sources.

Architecture:

VOLTAGE-FEEDBACK - The use of voltage-feedback architecture guarantees stability, wide bandwidth, and accurate signal amplification in various applications.

Packing Method:

TR - The TR packing method facilitates easy handling, transportation, and storage, ensuring product integrity and protection during distribution.

Nominal Slow Rate:

0.12 V/us - The moderate nominal slew rate allows for controlled and accurate amplification of signals without introducing excessive distortion or overshoot.

Terminal Pitch:

1.27 mm - The standard terminal pitch of 1.27mm facilitates easy mounting and compatibility in various circuit layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TLC2254AIDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

±2.2/±8/4.4/16 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

Yes

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

210 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

83 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

1000 uV

Minimum Voltage Gain:

10000

Minimum Slew Rate:

0.05 V/us

Nominal Slew Rate:

0.12 V/us

Maximum Input Offset Current (IIO):

60 pA

Peak Bias Current:

1 nA

Maximum Bias Current (IIB) @25 °C:

60 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

250 μA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP14,.25

Trade Compliance

TLC2254AIDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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