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TLC1078CJG

Texas Instruments

TLC1078CJG by Texas Instruments

TLC1078CJG by Texas Instruments is an Operational Amplifier with 2 functions, low-offset, and micropower features. It has a max input offset voltage of 950 uV, nominal unity gain bandwidth of 110 kHz, and operates at temperatures from 0 to 70 °C. Ideal for applications requiring precise signal amplification in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,194 parts In-Stock

1+ parts

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8,194

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Digiode

USA . 4,550 parts In-Stock

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4,550

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 185 parts In-Stock

1+ parts

$5.190

100+ parts

-

1k+ parts

$5.795

10k+ parts

-

185

$5.190

-

$5.795

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ChromeModa Solutions

Germany . 463 parts In-Stock

1+ parts

$5.831

100+ parts

$4.781

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-

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463

$5.831

$4.781

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IDEA Electronic Components Group

UK . 80 parts In-Stock

1+ parts

$5.831

100+ parts

-

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$5.248

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80

$5.831

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$5.248

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One Stop Electronics

USA . 1,534 parts In-Stock

1+ parts

$7.410

100+ parts

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1,534

$7.410

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AZTECH Wire

Italy . 206 parts In-Stock

1+ parts

$15.094

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206

$15.094

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Corphita

USA . 3,497 parts In-Stock

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3,497

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DigiPath Technology Company

USA . 2,167 parts In-Stock

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$5.257

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2,167

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$5.257

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Kepictronics

USA . 174 parts In-Stock

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174

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Overview

Enhance the performance of your electronic designs with the TLC1078CJG operational amplifier from Texas Instruments, a trusted manufacturer known for its high-quality components. Perfect for a wide range of applications, this op amp offers customers unparalleled value with its low-offset, low-bias, micropower design. Experience superior functionality and reliability with the TLC1078CJG, featuring a nominal unity gain bandwidth of 110 kHz and maximum supply current of 0.066 mA. Trust Texas Instruments to deliver innovative solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Maximum Input Offset Voltage: 950 uV

Low input offset voltage allows for accurate signal processing and minimal distortion.

Nominal Common Mode Reject Ratio: 97 dB

High common mode rejection ratio helps in reducing noise and interference from the input signal.

Minimum Voltage Gain: 200,000

High voltage gain ensures amplification of weak signals with minimal distortion.

Nominal Unity Gain Bandwidth: 110 kHz

Provides a wide bandwidth for signal processing across different frequencies.

Low-Bias: YES

Low bias current results in minimal power consumption and improved efficiency.

Technical Specifications

Operational Amplifiers (Op Amps) TLC1078CJG attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

CMOS

Power Supply:

5/10 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

Yes

Micropower:

Yes

Performance Specifications

Nominal Unity Gain Bandwidth:

110 kHz

Nominal Common Mode Rejection Ratio (CMRR ):

97 dB

Input Offset Voltage Limit:

950 uV

Minimum Voltage Gain:

200000

Peak Bias Current:

600 pA

Maximum Bias Current (IIB) @25 °C:

100 pA

Operational Characteristics

Nominal Supply Voltage:

10 V

Maximum Supply Voltage:

18 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

66 μA

Physical Characteristics

Length:

0.378 in (9.6 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

8

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Ceramic, Glass-Sealed

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-GDIP-T8

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP8,.3

Trade Compliance

TLC1078CJG Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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