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TLC0838CDWG4

Texas Instruments

TLC0838CDWG4 by Texas Instruments

TLC0838CDWG4 by Texas Instruments is an 8-bit ADC with 8 analog in channels, 0.3906% max linearity error, and 32us conversion time. Ideal for commercial applications requiring a small outline package, it operates at temperatures from 0 to 70°C with a supply voltage of 5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,817 parts In-Stock

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Digiode

USA . 1,845 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 398 parts In-Stock

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$13.113

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Parana Technologies

USA . 2,007 parts In-Stock

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$14.523

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$14.962

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DigiPath Technology Company

USA . 1,630 parts In-Stock

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$15.992

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$14.712

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$15.992

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ChromeModa Solutions

Germany . 6,985 parts In-Stock

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$16.318

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$13.381

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$16.318

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IDEA Electronic Components Group

UK . 938 parts In-Stock

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$16.318

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$15.502

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$14.686

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938

$16.318

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$14.686

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One Stop Electronics

USA . 1,504 parts In-Stock

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$30.000

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Microchip USA

USA . 1,422 parts In-Stock

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Corphita

USA . 910 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of precision with the Texas Instruments TLC0838CDWG4 Analog-to-Digital Converter. Crafted by a trusted manufacturer, this high-quality device offers 8 analog input channels in a compact package. Ideal for a variety of applications, this converter provides reliable and efficient conversion with minimal linearity error. With a fast conversion time and low power consumption, the TLC0838CDWG4 is the perfect choice for customers seeking accuracy and performance in their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection and durability for the converter, making it suitable for various applications.

No. of Analog In Channels: 8

Having 8 analog input channels allows for flexibility in connecting multiple sensor inputs or signals.

Surface Mount: YES

Surface mount capability makes it easy to integrate into circuit boards for compact and efficient designs.

No. of Bits: 8

With 8 bits resolution, this converter can provide sufficient accuracy for many analog to digital conversion needs.

Power Supplies (V): 5

Operating at a standard 5V power supply makes it compatible with many existing systems and circuits.

Temperature Grade: COMMERCIAL

Commercial grade temperature range allows for reliable operation in typical indoor environments.

Sample Rate: 0.031 MHz

High sample rate ensures quick and accurate conversion of analog signals to digital data.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable performance.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

Successive approximation ADC type provides accurate conversion results with relatively faster conversion times.

Technical Specifications

Analog-to-Digital Converters TLC0838CDWG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

8

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

31 kHz

Hold Mode:

Sample

Maximum Conversion Time:

32 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Minimum Supply Voltage:

4.5 V

Maximum Supply Current:

1.25 mA

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC0838CDWG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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