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TLC082IDRG4

Texas Instruments

TLC082IDRG4 by Texas Instruments

TLC082IDRG4 by Texas Instruments is an Operational Amplifier with 2 functions, offering a Nominal Voltage of 5V and Max Input Offset Voltage of 1900uV. Ideal for automotive applications due to its Low-Bias feature, BIMOS technology, and wide operating temperature range from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,321 parts In-Stock

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7,321

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Digiode

USA . 4,714 parts In-Stock

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4,714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 410 parts In-Stock

1+ parts

$2.708

100+ parts

-

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$3.191

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410

$2.708

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$3.191

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DigiPath Technology Company

USA . 2,340 parts In-Stock

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$2.982

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2,340

$2.982

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ChromeModa Solutions

Germany . 6,640 parts In-Stock

1+ parts

$3.043

100+ parts

$2.495

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6,640

$3.043

$2.495

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IDEA Electronic Components Group

UK . 455 parts In-Stock

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$3.043

100+ parts

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$2.739

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455

$3.043

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$2.739

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One Stop Electronics

USA . 849 parts In-Stock

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$3.410

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849

$3.410

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AZTECH Wire

Italy . 716 parts In-Stock

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$17.252

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716

$17.252

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Corphita

USA . 1,508 parts In-Stock

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Microchip USA

USA . 1,321 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,144 parts In-Stock

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Overview

Enhance your electronic designs with the Texas Instruments TLC082IDRG4 Operational Amplifier. Crafted by a renowned manufacturer, this Op Amp offers unparalleled quality and reliability. Ideal for a wide range of applications, this product delivers exceptional performance with low bias current and high voltage gain bandwidth. With a compact package design and advanced technology, the TLC082IDRG4 is the perfect choice for demanding projects where precision and efficiency are crucial. Elevate your circuitry today with this versatile operational amplifier from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the operational amplifier.

Maximum Input Offset Voltage: 1900 uV

Ensures accurate voltage output without any offset errors.

Maximum Average Bias Current (IIB): 0.0007 uA

Low bias current helps in reducing power consumption and improves overall performance.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Nominal Common Mode Reject Ratio: 110 dB

Provides high rejection of common mode signals, resulting in cleaner output signals.

Nominal Supply Voltage / Vsup (V): 5

Works efficiently under a standard supply voltage, making it compatible with various applications.

Minimum Slew Rate: 9.5 V/us

Fast slew rate enables the operational amplifier to respond quickly to input changes.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for industrial and automotive applications.

Technology: BIMOS

Combines the advantages of Bipolar and CMOS technologies, offering high performance and low power consumption.

Amplifier Type: OPERATIONAL AMPLIFIER

Specifically designed for amplifying signals accurately with low noise and distortion.

Technical Specifications

Operational Amplifiers (Op Amps) TLC082IDRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIMOS

Power Supply:

±2.25/±8/4.5/16 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

Yes

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

10 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

110 dB

Minimum Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

1900 uV

Minimum Voltage Gain:

100000

Minimum Slew Rate:

9.5 V/us

Nominal Slew Rate:

16 V/us

Maximum Input Offset Current (IIO):

50 pA

Peak Bias Current:

700 pA

Maximum Bias Current (IIB) @25 °C:

50 pA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

17 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

5 mA

Physical Characteristics

Length:

0.193 in (4.9 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

8

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tape And Reel

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TLC082IDRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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