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TL972IPWG4

Texas Instruments

TL972IPWG4 by Texas Instruments

TL972IPWG4 by Texas Instruments is a dual operational amplifier with 6000uV max input offset voltage and 1uA max average bias current. Ideal for automotive applications, it offers 85dB nominal CMRR and operates at -40 to 125 °C. With a compact design of 5x4.4mm, it features VFB architecture and has a unity gain bandwidth of 12MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,757 parts In-Stock

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8,757

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Digiode

USA . 3,686 parts In-Stock

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3,686

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Nova Conductors

Japan . 58 parts In-Stock

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 299 parts In-Stock

1+ parts

$0.410

100+ parts

$0.400

1k+ parts

$0.398

10k+ parts

-

299

$0.410

$0.400

$0.398

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Corohmni

South Africa . 62 parts In-Stock

1+ parts

$0.681

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62

$0.681

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Parana Technologies

USA . 1,608 parts In-Stock

1+ parts

$1.865

100+ parts

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$2.412

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1,608

$1.865

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$2.412

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ChromeModa Solutions

Germany . 5,793 parts In-Stock

1+ parts

$2.095

100+ parts

$1.718

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5,793

$2.095

$1.718

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IDEA Electronic Components Group

UK . 499 parts In-Stock

1+ parts

$2.095

100+ parts

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$1.886

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499

$2.095

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$1.886

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Ampacity Inc.

Singapore . 397 parts In-Stock

1+ parts

$5.410

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397

$5.410

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One Stop Electronics

USA . 187 parts In-Stock

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$5.410

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187

$5.410

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AZTECH Wire

Italy . 241 parts In-Stock

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$14.919

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$14.919

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Continental Prestige Electronics

USA . 2,650 parts In-Stock

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Argo Parts USA

USA . 2,561 parts In-Stock

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Corphita

USA . 2,033 parts In-Stock

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DigiPath Technology Company

USA . 873 parts In-Stock

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$1.889

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873

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$1.889

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Bastille Electronics

Australia . 55 parts In-Stock

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55

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Overview

Discover the exceptional performance and reliability of the TL972IPWG4 operational amplifier by Texas Instruments. Designed with precision and innovation, this amplifier offers unparalleled quality for a wide range of applications. With its compact design and advanced features, this product provides customers with superior value and efficiency. Whether you're in the automotive industry or working on electronic projects, the TL972IPWG4 is the perfect choice to enhance your work with its high performance and versatility. Elevate your projects with the premium quality of Texas Instruments products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Maximum Input Offset Voltage: 6000 uV

Low input offset voltage helps in reducing errors in signal processing, providing accurate results.

Maximum Average Bias Current (IIB): 1 uA

Low bias current ensures minimal power consumption and improves the overall efficiency of the amplifier.

Surface Mount: YES

Surface mounting capability allows for easy and compact integration into electronic circuits.

Nominal Common Mode Reject Ratio: 85 dB

High common mode rejection ratio ensures suppression of common noise, leading to clean and reliable signal amplification.

Nominal Supply Voltage / Vsup (V): 2.5

Stable supply voltage ensures consistent performance of the operational amplifier in different operating conditions.

Minimum Slew Rate: 3.5 V/us

Fast slew rate enables the amplifier to respond quickly to input signal changes, making it suitable for dynamic signal processing applications.

Maximum Supply Voltage Limit: 15 V

Wide supply voltage range allows for flexibility in power supply selection and supports diverse applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards, ensuring reliable performance in harsh environmental conditions.

Nominal Unity Gain Bandwidth: 12000 kHz

High unity gain bandwidth enables the amplifier to accurately reproduce high frequency signals with minimal distortion.

Maximum Supply Current: 6.4 mA

Low supply current consumption helps in conserving power and extends the battery life of portable devices.

Technical Specifications

Operational Amplifiers (Op Amps) TL972IPWG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.35/±6/2.7/12 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

12 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

3160

Minimum Slew Rate:

3.5 V/us

Nominal Slew Rate:

5 V/us

Peak Bias Current:

1 uA

Maximum Bias Current (IIB) @25 °C:

750 nA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-2.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

6.4 mA

Physical Characteristics

Length:

0.197 in (5 mm)

Width:

0.173 in (4.4 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Total Terminals:

14

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP14,.25

Trade Compliance

TL972IPWG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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