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TL972IDG4

Texas Instruments

TL972IDG4 by Texas Instruments

TL972IDG4 by Texas Instruments is a dual operational amplifier with 14 terminals. It features a max input offset voltage of 6000 uV and a min slew rate of 3.5 V/us. Ideal for automotive applications, this op amp has a nominal unity gain bandwidth of 12 MHz and operates at temperatures ranging from -40 to 125 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,683 parts In-Stock

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6,683

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Digiode

USA . 610 parts In-Stock

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610

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Distributors (Availability)

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Parana Technologies

USA . 563 parts In-Stock

1+ parts

$5.714

100+ parts

$530.613

1k+ parts

$5.142

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563

$5.714

$530.613

$5.142

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DigiPath Technology Company

USA . 1,629 parts In-Stock

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$6.292

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1,629

$6.292

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ChromeModa Solutions

Germany . 3,502 parts In-Stock

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$6.420

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$5.264

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3,502

$6.420

$5.264

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IDEA Electronic Components Group

UK . 230 parts In-Stock

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$6.420

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$5.778

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230

$6.420

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$5.778

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One Stop Electronics

USA . 540 parts In-Stock

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$7.410

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540

$7.410

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AZTECH Wire

Italy . 367 parts In-Stock

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$16.660

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$16.660

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Corphita

USA . 285 parts In-Stock

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Overview

Experience unparalleled performance and reliability with the TL972IDG4 operational amplifier by Texas Instruments. Crafted with precision and expertise, this high-quality component is designed to excel in a wide range of applications. From automotive systems to industrial machinery, the TL972IDG4 offers exceptional value, delivering superior functionality and efficiency. Trust in Texas Instruments for top-notch products that elevate your projects to new heights. Elevate your designs with the TL972IDG4 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the operational amplifier, ensuring a longer lifespan.

Maximum Input Offset Voltage: 6000 uV

Low input offset voltage ensures accurate performance and minimal error in signal processing applications.

Maximum Average Bias Current (IIB): 1 uA

Low bias current helps in reducing power consumption and improving the accuracy of amplification.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying assembly processes.

Nominal Common Mode Reject Ratio: 85 dB

High common mode rejection ratio ensures that unwanted signals or noise are effectively rejected, resulting in cleaner output signals.

Nominal Supply Voltage / Vsup (V): 2.5

A low nominal supply voltage requirement makes this operational amplifier suitable for low power applications or portable devices.

Minimum Slew Rate: 3.5 V/us

Fast slew rate allows for rapid response to input signal changes, making this operational amplifier ideal for high-speed applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures stability and reliability in various environmental conditions, making it suitable for industrial or automotive applications.

Nominal Unity Gain Bandwidth: 12000 kHz

High unity gain bandwidth ensures high-frequency performance, making it suitable for applications that require accurate signal processing in a wide frequency range.

Maximum Supply Current: 6.4 mA

Low supply current consumption helps in reducing power usage and heat dissipation, making this operational amplifier energy-efficient.

Technical Specifications

Operational Amplifiers (Op Amps) TL972IDG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

±1.35/±6/2.7/12 V

Total Functions:

2

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

12 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

85 dB

Input Offset Voltage Limit:

6000 uV

Minimum Voltage Gain:

3160

Minimum Slew Rate:

3.5 V/us

Nominal Slew Rate:

5 V/us

Peak Bias Current:

1 uA

Maximum Bias Current (IIB) @25 °C:

750 nA

Operational Characteristics

Nominal Supply Voltage:

2.5 V

Maximum Supply Voltage:

15 V

Maximum Negative Supply Voltage:

-2.5 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Reflow Peak Time Limit:

30 s

Maximum Supply Current:

6.4 mA

Physical Characteristics

Length:

0.341 in (8.65 mm)

Width:

0.154 in (3.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Total Terminals:

14

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel Palladium Gold

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

SOP

Package Shape:

Package Style:

Small Outline

Package Equivalence Code:

SOP8,.25

Trade Compliance

TL972IDG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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