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TL432CDBZTG4

Texas Instruments

TL432CDBZTG4 by Texas Instruments

TL432CDBZTG4 by Texas Instruments is a voltage reference IC with adjustable output (2.44-2.55V) and max output current of 0.1A. It is ideal for applications requiring precise voltage regulation in commercial temperature grades, featuring a small outline package with dual terminals for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 9,550 parts In-Stock

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Vyrian

USA . 7,435 parts In-Stock

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Digiode

USA . 2,743 parts In-Stock

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Semicontronic

India . 1,239 parts In-Stock

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$1.500

100+ parts

$1.462

1k+ parts

$1.455

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$1.500

$1.462

$1.455

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One Stop Electronics

USA . 533 parts In-Stock

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$4.500

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533

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Ampacity Inc.

Singapore . 1,381 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 337 parts In-Stock

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$9.041

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337

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Parana Technologies

USA . 1,623 parts In-Stock

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$9.125

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$9.777

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DigiPath Technology Company

USA . 1,265 parts In-Stock

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$10.048

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

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$10.253

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$9.740

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$9.228

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ChromeModa Solutions

Germany . 49 parts In-Stock

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$10.253

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$8.407

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QUARKTWIN TECHNOLOGY LTD

USA . 25,968 parts In-Stock

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Metaverse IC Inc.

Canada . 19,005 parts In-Stock

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Microchip USA

USA . 6,840 parts In-Stock

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Corphita

USA . 3,242 parts In-Stock

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Corohmni

South Africa . 497 parts In-Stock

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Overview

When it comes to voltage references, the TL432CDBZTG4 by Texas Instruments stands out for its superior quality and reliability. With a manufacturer like Texas Instruments behind it, you can trust that this product is designed to perform at its best. Ideal for a wide range of applications, this voltage reference offers customers the value of precision and stability in their circuits. Say goodbye to fluctuating voltages and hello to consistent performance with the TL432CDBZTG4. Trust Texas Instruments to deliver excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring long-lasting performance.

Surface Mount: YES

Easy to integrate into circuit boards, saving time and making installation more efficient.

Trim or Adjustable Output (V): YES

Allows for customization and fine-tuning of the output voltage to meet specific application requirements.

Minimum Output Voltage: 2.44 V

Provides a stable minimum output voltage for reliable operation of connected devices.

Maximum Operating Temperature: 70 °C

Can withstand high temperatures, making it versatile and suitable for a wide range of environments.

Maximum Output Current: 0.1 A

Capable of delivering a sufficient current for powering various components within a circuit.

Technology: BIPOLAR

Utilizes bipolar technology for accurate and stable voltage references, ensuring consistent performance.

Nominal Output Voltage: 2.495 V

Offers a reliable and stable output voltage for use in various electronic applications.

Technical Specifications

Voltage References TL432CDBZTG4 attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

Additional Features:

OUTPUT VOLTAGE ADJUSTABLE FROM 2.495V TO 36V

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

.1 A

Maximum Output Voltage:

2.55 V

Minimum Output Voltage:

2.44 V

Nominal Output Voltage:

2.495 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Maximum Supply Voltage (Vsup):

36 V

Minimum Supply Voltage (Vsup):

2.495 V

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

143.143 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

YES

Width (mm):

1.3 mm

Trade Compliance

TL432CDBZTG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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