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TL4050C41QDBZT

Texas Instruments

TL4050C41QDBZT by Texas Instruments

TL4050C41QDBZT by Texas Instruments is a 3-terminal voltage reference with output voltage of 4.096V, tolerance of 0.5%, and temp coef of 50 ppm/°C. Ideal for automotive applications due to its thin profile, small outline package style, and operating temperature range from -40 to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,780 parts In-Stock

1+ parts

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8,780

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Digiode

USA . 1,617 parts In-Stock

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1,617

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Distributors (Availability)

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Semicontronic

India . 1,629 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

1,629

$0.500

$0.488

$0.485

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Parana Technologies

USA . 2,096 parts In-Stock

1+ parts

$1.036

100+ parts

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$1.903

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2,096

$1.036

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$1.903

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DigiPath Technology Company

USA . 1,423 parts In-Stock

1+ parts

$1.141

100+ parts

$1.049

1k+ parts

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1,423

$1.141

$1.049

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ChromeModa Solutions

Germany . 4,277 parts In-Stock

1+ parts

$1.164

100+ parts

$0.954

1k+ parts

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4,277

$1.164

$0.954

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IDEA Electronic Components Group

UK . 2,096 parts In-Stock

1+ parts

$1.164

100+ parts

-

1k+ parts

$1.048

10k+ parts

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2,096

$1.164

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$1.048

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One Stop Electronics

USA . 1,184 parts In-Stock

1+ parts

$6.500

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1,184

$6.500

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AZTECH Wire

Italy . 394 parts In-Stock

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$7.024

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394

$7.024

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Corphita

USA . 3,876 parts In-Stock

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3,876

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Microchip USA

USA . 1,937 parts In-Stock

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1,937

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Corohmni

South Africa . 340 parts In-Stock

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340

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Overview

Enhance your electronic designs with the TL4050C41QDBZT voltage reference by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers a cutting-edge solution for applications requiring precise voltage regulation. Whether you are working on automotive electronics or industrial control systems, this small outline, thin profile device offers a nominal output voltage of 4.096V with a maximum voltage tolerance of 0.5%. Trust in Texas Instruments to provide the best-in-class components for your projects, ensuring optimal performance and long-term stability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the voltage reference, ensuring long-term reliability.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and making assembly more efficient.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Nominal Output Voltage: 4.096 V

Provides a stable output voltage, ensuring accurate and reliable performance in applications.

Technical Specifications

Voltage References TL4050C41QDBZT attributes and parameters. Explore more Voltage References devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e4

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Voltage:

4.11648 V

Minimum Output Voltage:

4.07552 V

Nominal Output Voltage:

4.096 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TO-236

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.12 mm

Sub-Category:

Voltage References

Surface Mount:

YES

Technology:

BIPOLAR

Max Voltage Temp Coef:

50 ppm/Cel

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trim or Adjustable Output (V):

NO

Maximum Voltage Tolerance:

.5 %

Width (mm):

1.3 mm

Trade Compliance

TL4050C41QDBZT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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