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TL33074N

Texas Instruments

TL33074N by Texas Instruments

TL33074N by Texas Instruments is an Operational Amplifier with 4 functions, 7000uV max input offset voltage, and -1.8uA max average bias current. It is ideal for industrial applications requiring a high common mode reject ratio of 97dB and a unity gain bandwidth of 4500kHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,585 parts In-Stock

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5,585

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Digiode

USA . 2,054 parts In-Stock

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2,054

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Distributors (Availability)

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One Stop Electronics

USA . 367 parts In-Stock

1+ parts

$4.410

100+ parts

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367

$4.410

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Parana Technologies

USA . 544 parts In-Stock

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$5.043

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$5.603

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544

$5.043

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$5.603

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ChromeModa Solutions

Germany . 1,816 parts In-Stock

1+ parts

$5.666

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$4.646

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1,816

$5.666

$4.646

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IDEA Electronic Components Group

UK . 973 parts In-Stock

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$5.666

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$5.099

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973

$5.666

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$5.099

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AZTECH Wire

Italy . 372 parts In-Stock

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$6.134

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372

$6.134

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Corphita

USA . 2,162 parts In-Stock

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DigiPath Technology Company

USA . 924 parts In-Stock

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$5.108

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924

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$5.108

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Enhance your electronic designs with the Texas Instruments TL33074N Operational Amplifier. Crafted by a trusted manufacturer, this high-quality component offers unparalleled performance in a variety of applications. With its 4 functions and advanced technology, this Op Amp ensures precise signal amplification and reliable operation. Experience the benefits of its wide temperature range, low bias current, and exceptional voltage gain. Trust the TL33074N to deliver superior results for all your industrial projects. Elevate your circuits with Texas Instruments' top-of-the-line operational amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the operational amplifier, making it suitable for various environments and applications.

Nominal Common Mode Reject Ratio: 97 dB

High common mode rejection ratio ensures effective rejection of common mode noise and interference, resulting in clean and accurate signal processing.

Nominal Supply Voltage / Vsup (V): 15

Operates at a standard supply voltage of 15V, making it compatible with common power supply configurations.

Minimum Slew Rate: 8 V/us

Fast slew rate allows for quick response to changes in input signals, enabling high-speed signal processing and accurate amplification.

Nominal Unity Gain Bandwidth: 4500 kHz

High unity gain bandwidth ensures stable performance at various gain settings, making it suitable for a wide range of amplification applications.

Technical Specifications

Operational Amplifiers (Op Amps) TL33074N attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/±15 V

Total Functions:

4

Sub-Category:

Operational Amplifiers

Frequency Compensation:

Yes

Low-Offset:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

4.5 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

97 dB

Minimum Common Mode Rejection Ratio (CMRR ):

70 dB

Input Offset Voltage Limit:

7000 uV

Minimum Voltage Gain:

25000

Minimum Slew Rate:

8 V/us

Nominal Slew Rate:

10 V/us

Peak Bias Current:

-1.8 uA

Maximum Bias Current (IIB) @25 °C:

1.5 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

22 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-22 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Maximum Supply Current:

18.8 mA

Physical Characteristics

Length:

0.76 in (19.305 mm)

Width:

0.3 in (7.62 mm)

Maximum Seated Height:

0.2 in (5.08 mm)

Total Terminals:

14

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

No

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDIP-T14

Packaging and Shipping

Package Code:

DIP

Package Shape:

Package Style:

In Line

Package Equivalence Code:

DIP14,.3

Trade Compliance

TL33074N Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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