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TL321MFK

Texas Instruments

TL321MFK by Texas Instruments

TL321MFK by Texas Instruments is a ceramic square-shaped operational amplifier (Op Amp) with 20 terminals in a chip carrier package. It operates b/w -55°C to 125°C, suitable for military-grade applications. Featuring voltage-feedback architecture, it has power supplies of 5/30V and frequency compensation for precise signal processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,894 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,894

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-

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Digiode

USA . 3,234 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,135 parts In-Stock

1+ parts

$6.025

100+ parts

-

1k+ parts

$6.799

10k+ parts

-

2,135

$6.025

-

$6.799

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DigiPath Technology Company

USA . 839 parts In-Stock

1+ parts

$6.635

100+ parts

$6.104

1k+ parts

-

10k+ parts

-

839

$6.635

$6.104

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ChromeModa Solutions

Germany . 6,370 parts In-Stock

1+ parts

$6.770

100+ parts

$5.551

1k+ parts

-

10k+ parts

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6,370

$6.770

$5.551

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IDEA Electronic Components Group

UK . 635 parts In-Stock

1+ parts

$6.770

100+ parts

-

1k+ parts

$6.093

10k+ parts

-

635

$6.770

-

$6.093

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One Stop Electronics

USA . 1,085 parts In-Stock

1+ parts

$8.410

100+ parts

-

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10k+ parts

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1,085

$8.410

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AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$10.093

100+ parts

-

1k+ parts

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10k+ parts

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541

$10.093

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Corphita

USA . 4,806 parts In-Stock

1+ parts

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4,806

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Overview

Elevate your next project with the TL321MFK operational amplifier by Texas Instruments. Crafted with precision and excellence, this high-quality chip carrier boasts a ceramic package body and military-grade temperature tolerance, ensuring reliable performance in extreme conditions. Ideal for voltage-feedback applications, this op amp offers unparalleled stability and versatility. Trust in Texas Instruments' legacy of innovation and experience the value of superior engineering with the TL321MFK.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity, allowing for efficient heat dissipation and improved reliability.

Surface Mount: YES

Surface mount capability makes the product suitable for modern assembly techniques, saving space on circuit boards.

Package Shape: SQUARE

The square package shape facilitates easier placement and routing on circuit boards, optimizing space utilization.

Power Supplies (V): 5/30

Wide range of power supply voltages allows for versatile applications in various electronic systems.

No. of Terminals: 20

Higher number of terminals enable more versatile connectivity options and support complex circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packages are compact and lightweight, making them ideal for portable electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in demanding environments.

Frequency Compensation: YES

Frequency compensation feature helps improve stability and prevent oscillations in feedback loops.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in harsh cold environments without impacting performance.

Terminal Position: QUAD

Quad terminal position enhances connectivity and signal routing options, enabling versatile circuit configurations.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability and durability in extreme operating conditions.

Technology: BIPOLAR

Bipolar technology offers low noise, high bandwidth, and precise performance characteristics in amplifier applications.

Terminal Form: NO LEAD

No lead terminal form simplifies soldering process and enhances reliability of connections.

Amplifier Type: OPERATIONAL AMPLIFIER

Operational amplifiers are widely used in signal processing applications due to their high gain and differential input capabilities.

Architecture: VOLTAGE-FEEDBACK

Voltage-feedback architecture offers superior linearity, stability, and bandwidth in amplification circuits.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for compact design, precise connections, and high-density integration in circuit layouts.

Technical Specifications

Operational Amplifiers (Op Amps) TL321MFK attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

5/30 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

No

Programmable Power:

No

Operational Characteristics

Lowest Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Physical Characteristics

Total Terminals:

20

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Position:

Quad

Terminal Form:

Package Body Material:

Ceramic

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-XQCC-N20

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Chip Carrier

Package Equivalence Code:

LCC20,.35SQ

Trade Compliance

TL321MFK Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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