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THVD1406DRLR

Texas Instruments

THVD1406DRLR by Texas Instruments

THVD1406DRLR by Texas Instruments is a line driver with 8 terminals, operating b/w -40 to 125 °C. It supports EIA-422, EIA-485-A, TIA-485-A standards and has a max supply voltage of 5.5 V. Ideal for applications requiring differential output and Schmitt trigger input characteristics.

Median Price

$1.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 11,000 parts In-Stock

1+ parts

$1.391

100+ parts

$1.149

1k+ parts

$0.621

10k+ parts

-

11,000

$1.391

$1.149

$0.621

-

DigiKey

USA . 22,565 parts In-Stock

1+ parts

$1.950

100+ parts

$1.169

1k+ parts

$1.028

10k+ parts

$0.959

22,565

$1.950

$1.169

$1.028

$0.959

Mouser Electronics

USA . 4,193 parts In-Stock

1+ parts

$1.950

100+ parts

$1.170

1k+ parts

$1.030

10k+ parts

$0.971

4,193

$1.950

$1.170

$1.030

$0.971

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.690

-

-

-

Digiode

USA . 114 parts In-Stock

1+ parts

$1.321

100+ parts

-

1k+ parts

-

10k+ parts

-

114

$1.321

-

-

-

Vyrian

USA . 6,361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,361

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,426 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

$0.676

5,426

$0.690

-

-

$0.676

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

$0.655

10k+ parts

$0.642

2,000

$0.690

-

$0.655

$0.642

Argo Parts USA

USA . 317 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

$0.669

317

$0.690

-

-

$0.669

Semicontronic

India . 8,971 parts In-Stock

1+ parts

$1.180

100+ parts

$1.150

1k+ parts

$1.145

10k+ parts

-

8,971

$1.180

$1.150

$1.145

-

Corphita

USA . 2,570 parts In-Stock

1+ parts

$1.252

100+ parts

-

1k+ parts

-

10k+ parts

-

2,570

$1.252

-

-

-

Ampacity Inc.

Singapore . 8,853 parts In-Stock

1+ parts

$2.570

100+ parts

-

1k+ parts

-

10k+ parts

-

8,853

$2.570

-

-

-

Parana Technologies

USA . 1,996 parts In-Stock

1+ parts

$7.665

100+ parts

-

1k+ parts

$8.192

10k+ parts

-

1,996

$7.665

-

$8.192

-

DigiPath Technology Company

USA . 450 parts In-Stock

1+ parts

$8.440

100+ parts

$7.765

1k+ parts

-

10k+ parts

-

450

$8.440

$7.765

-

-

ChromeModa Solutions

Germany . 3,650 parts In-Stock

1+ parts

$8.612

100+ parts

$7.062

1k+ parts

-

10k+ parts

-

3,650

$8.612

$7.062

-

-

IDEA Electronic Components Group

UK . 1,072 parts In-Stock

1+ parts

$8.612

100+ parts

$8.181

1k+ parts

$7.751

10k+ parts

-

1,072

$8.612

$8.181

$7.751

-

AZTECH Wire

Italy . 679 parts In-Stock

1+ parts

$12.230

100+ parts

-

1k+ parts

-

10k+ parts

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679

$12.230

-

-

-

Corohmni

South Africa . 109 parts In-Stock

1+ parts

$12.834

100+ parts

-

1k+ parts

-

10k+ parts

-

109

$12.834

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,468 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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13,468

-

-

-

-

Overview

Elevate your communication systems with the Texas Instruments THVD1406DRLR Line Driver & Receiver. Designed with precision and reliability in mind, this product offers unparalleled quality and performance. Ideal for a wide range of applications, this line driver allows for seamless data transmission with minimal delay. Trust in Texas Instruments to provide you with cutting-edge technology that delivers value, benefits, and advantages to meet all your communication needs. Experience the difference with the THVD1406DRLR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external elements, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability enables easy and efficient installation, saving time and effort during the assembly process.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product is compatible with a wide range of applications and power sources.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into electronic circuits and systems, optimizing space efficiency.

Maximum Transmit Delay: 500 ns

Fast transmit delay of 500 ns ensures quick and responsive data transmission, ideal for high-speed communication.

No. of Terminals: 8

8 terminals provide ample connectivity options, allowing for versatile and flexible configurations in various setups.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Small outline and thin profile design make this product suitable for compact and space-constrained applications, offering increased design flexibility.

Minimum Supply Voltage: 3 V

Low minimum supply voltage of 3 V allows for energy-efficient operation and compatibility with lower power systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliability and performance in harsh environmental conditions or industrial settings.

Output Characteristics: DIFFERENTIAL

Differential output characteristics provide noise immunity and signal integrity, making this product suitable for high-noise environments and long-distance communication.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range of -40°C allows for reliable operation in freezing conditions or extreme cold environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved connectivity, enhancing the overall reliability and performance of the product.

Maximum Seated Height: 0.6 mm

Low maximum seated height of 0.6 mm enables a compact and slim form factor, suitable for applications with space constraints.

Width: 1.2 mm

Narrow width of 1.2 mm allows for easy integration in tight spaces or on densely populated circuit boards.

Maximum Output Low Current: 4 Amp

High maximum output low current of 4 Amp enables the product to drive high loads or maintain signal integrity over long distances.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures balanced signal transmission and reception, reducing signal distortions and enhancing overall data accuracy.

Differential Output: YES

Differential output is ideal for noise-canceling and long-distance communication, providing improved signal quality and reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for efficient soldering and assembly processes, ensuring reliable and robust connections.

Length: 2.1 mm

Compact length of 2.1 mm facilitates easy installation and integration into various electronic devices or systems.

Minimum Out Swing: 1.5 V

Low minimum output swing of 1.5 V ensures compatibility with low-voltage devices while maintaining signal integrity and communication performance.

Maximum Receive Delay: 110 ns

Low receive delay of 110 ns enables quick data reception and processing, improving overall system responsiveness and efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, reducing the risk of signal loss or disconnection during operation.

Interface Standard: EIA-422; EIA-485-A; TIA-485-A

Compliance with multiple interface standards ensures seamless integration with various communication protocols and systems, enhancing interoperability and compatibility.

Maximum Supply Current: 3 mA

Low maximum supply current of 3 mA results in energy-efficient operation and reduced power consumption, making the product suitable for portable or battery-powered devices.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger input characteristics provide noise tolerance and signal conditioning, ensuring reliable and accurate data processing in challenging environments.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage of 5 V ensures consistent performance and compatibility with standard power sources, simplifying system design and integration.

Terminal Pitch: 0.5 mm

Narrow terminal pitch of 0.5 mm allows for high-density mounting and precise connections, suitable for compact designs and miniaturized applications.

Interface IC Type: LINE TRANSCEIVER

Integrated line transceiver IC type enhances signal processing capabilities and communication efficiency, making this product a reliable and high-performance choice for data transmission applications.

Technical Specifications

Line Drivers & Receivers THVD1406DRLR attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422; EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-F8

Length:

2.1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

4 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL8,.05,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Receive Delay:

110 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.6 mm

Maximum Supply Current:

3 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

500 ns

Width:

1.2 mm

Trade Compliance

THVD1406DRLR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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