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THS4501CDGNRG4

Texas Instruments

THS4501CDGNRG4 by Texas Instruments

THS4501CDGNRG4 by Texas Instruments is an Operational Amplifier with 0 uV Max Input Offset Voltage, 5 uA Max Average Bias Current, and 80 dB Nominal CMRR. Ideal for applications requiring high precision amplification in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,859 parts In-Stock

1+ parts

-

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8,859

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Digiode

USA . 3,377 parts In-Stock

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3,377

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 172 parts In-Stock

1+ parts

$2.410

100+ parts

-

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172

$2.410

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Parana Technologies

USA . 631 parts In-Stock

1+ parts

$4.293

100+ parts

-

1k+ parts

$4.719

10k+ parts

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631

$4.293

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$4.719

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DigiPath Technology Company

USA . 1,612 parts In-Stock

1+ parts

$4.728

100+ parts

$4.349

1k+ parts

-

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1,612

$4.728

$4.349

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ChromeModa Solutions

Germany . 4,942 parts In-Stock

1+ parts

$4.824

100+ parts

$3.956

1k+ parts

-

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4,942

$4.824

$3.956

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IDEA Electronic Components Group

UK . 505 parts In-Stock

1+ parts

$4.824

100+ parts

-

1k+ parts

$4.342

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505

$4.824

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$4.342

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AZTECH Wire

Italy . 542 parts In-Stock

1+ parts

$5.520

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542

$5.520

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Component Stockers USA

USA . 355 parts In-Stock

1+ parts

$99.990

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355

$99.990

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Corphita

USA . 3,289 parts In-Stock

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3,289

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Microchip USA

USA . 384 parts In-Stock

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384

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Overview

Experience the unmatched quality and reliability of Texas Instruments with the THS4501CDGNRG4 operational amplifier. Designed for precision and performance, this amplifier is perfect for a wide range of applications in various industries. From signal processing to sensor interfacing, this versatile amplifier offers exceptional value and benefits to customers. Trust in Texas Instruments to deliver superior products that meet your needs with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Maximum Input Offset Voltage: 0 uV

Having a low input offset voltage ensures accurate and precise performance of the operational amplifier.

Nominal Common Mode Reject Ratio: 80 dB

With a high common mode reject ratio, this operational amplifier can effectively reject common-mode signals, reducing noise and interference.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard power sources, enhancing its versatility.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this operational amplifier can function reliably in a variety of environments.

Nominal Unity Gain Bandwidth: 300000 kHz

The high unity gain bandwidth of 300000 kHz enables this operational amplifier to achieve high-speed and high-performance amplification.

Maximum Supply Current: 32 mA

The low maximum supply current of 32 mA helps in minimizing power consumption while maintaining efficient operation.

Technical Specifications

Operational Amplifiers (Op Amps) THS4501CDGNRG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Power Supply:

5/±5 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Unity Gain Bandwidth:

300 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

80 dB

Input Offset Voltage Limit:

0 uV

Nominal Slew Rate:

92 V/us

Peak Bias Current:

5 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

8.25 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-8.25 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

32 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

THS4501CDGNRG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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