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THS4141CDGKR

Texas Instruments

THS4141CDGKR by Texas Instruments

THS4141CDGKR by Texas Instruments is an Operational Amplifier with 8500uV Max Input Offset Voltage, 15uA Max Average Bias Current, and 84dB Nominal CMRR. Ideal for applications requiring precise signal amplification in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,213 parts In-Stock

1+ parts

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5,213

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Digiode

USA . 4,287 parts In-Stock

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-

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4,287

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 124 parts In-Stock

1+ parts

$4.110

100+ parts

-

1k+ parts

$4.566

10k+ parts

-

124

$4.110

-

$4.566

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ChromeModa Solutions

Germany . 4,027 parts In-Stock

1+ parts

$4.618

100+ parts

$3.787

1k+ parts

-

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4,027

$4.618

$3.787

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IDEA Electronic Components Group

UK . 94 parts In-Stock

1+ parts

$4.618

100+ parts

-

1k+ parts

$4.156

10k+ parts

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94

$4.618

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$4.156

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One Stop Electronics

USA . 1,153 parts In-Stock

1+ parts

$6.410

100+ parts

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1,153

$6.410

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AZTECH Wire

Italy . 717 parts In-Stock

1+ parts

$13.800

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717

$13.800

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Component Stockers USA

USA . 675 parts In-Stock

1+ parts

$99.990

100+ parts

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675

$99.990

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Corphita

USA . 1,782 parts In-Stock

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1,782

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DigiPath Technology Company

USA . 527 parts In-Stock

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$4.164

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527

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$4.164

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Microchip USA

USA . 498 parts In-Stock

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498

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Overview

Experience unmatched performance and reliability with the THS4141CDGKR operational amplifier by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products designed to meet the highest standards. The THS4141CDGKR is perfect for a wide range of applications, offering unparalleled precision and efficiency. With its compact design and advanced features, this operational amplifier provides exceptional value and benefits to customers looking for superior performance. Trust Texas Instruments for all your operational amplifier needs and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring long-term reliability

Maximum Input Offset Voltage: 8500 uV

Low input offset voltage for precision applications

Maximum Average Bias Current (IIB): 15 uA

Low bias current minimizes errors in signal processing

Surface Mount: YES

Easy to solder and mount onto PCBs, making installation convenient

Nominal Common Mode Reject Ratio: 84 dB

High common mode rejection ratio for rejection of unwanted signals

Nominal Supply Voltage / Vsup (V): 5

Suitable for low power applications with a standard supply voltage

Maximum Supply Voltage Limit: 16.5 V

Wide supply voltage range allows flexibility in power supply options

Maximum Operating Temperature: 70 °C

Operates reliably in a wide temperature range for versatility in applications

Temperature Grade: COMMERCIAL

Suitable for commercial applications with standard temperature requirements

Technology: BIPOLAR

Bipolar technology for high performance and accuracy in signal processing

Technical Specifications

Operational Amplifiers (Op Amps) THS4141CDGKR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Technology:

BIPOLAR

Power Supply:

5/30/±2.5/±15 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Performance Specifications

Nominal Common Mode Rejection Ratio (CMRR ):

84 dB

Input Offset Voltage Limit:

8500 uV

Nominal Slew Rate:

450 V/us

Peak Bias Current:

15 uA

Operational Characteristics

Nominal Supply Voltage:

5 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-5 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Maximum Supply Current:

18 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.043 in (1.1 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

THS4141CDGKR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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