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THS4011CDGNG4

Texas Instruments

THS4011CDGNG4 by Texas Instruments

THS4011CDGNG4 by Texas Instruments is an Operational Amplifier with 8000uV Max Input Offset Voltage, 110dB CMRR, and 300V/us Min Slew Rate. Ideal for applications requiring high precision amplification in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,215 parts In-Stock

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2,215

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Digiode

USA . 60 parts In-Stock

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60

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,621 parts In-Stock

1+ parts

$0.999

100+ parts

-

1k+ parts

$1.882

10k+ parts

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1,621

$0.999

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$1.882

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ChromeModa Solutions

Germany . 3,080 parts In-Stock

1+ parts

$1.122

100+ parts

$0.920

1k+ parts

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3,080

$1.122

$0.920

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IDEA Electronic Components Group

UK . 500 parts In-Stock

1+ parts

$1.122

100+ parts

-

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$1.010

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500

$1.122

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$1.010

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One Stop Electronics

USA . 1,503 parts In-Stock

1+ parts

$8.410

100+ parts

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1,503

$8.410

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AZTECH Wire

Italy . 426 parts In-Stock

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$8.641

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426

$8.641

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Corphita

USA . 1,877 parts In-Stock

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1,877

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Microchip USA

USA . 998 parts In-Stock

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998

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DigiPath Technology Company

USA . 785 parts In-Stock

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$1.012

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785

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$1.012

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Overview

Enhance your electronic designs with the THS4011CDGNG4 operational amplifier by Texas Instruments. Crafted with precision and expertise, Texas Instruments guarantees top-notch quality and reliability in every product. This versatile op amp is perfect for a wide range of applications, offering unparalleled performance and efficiency. Experience seamless operation and unmatched precision with the THS4011CDGNG4, making it the ideal choice for all your amplification needs. Elevate your projects with this exceptional amplifier and witness the difference in performance and quality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the operational amplifier, making it suitable for a variety of environments.

Maximum Input Offset Voltage: 8000 uV

The low maximum input offset voltage ensures accurate and precise signal processing, making this operational amplifier ideal for applications requiring high precision.

Maximum Average Bias Current (IIB): 8 uA

The low maximum average bias current helps in minimizing power consumption and improving efficiency in circuits where this operational amplifier is used.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation of this operational amplifier on circuit boards, saving space and facilitating mass production.

Nominal Common Mode Reject Ratio: 110 dB

The high nominal common mode reject ratio ensures that the operational amplifier can effectively filter out common mode noise and interference, resulting in clean and accurate signal output.

Nominal Supply Voltage / Vsup (V): 15

The nominal supply voltage of 15V provides sufficient power for the operational amplifier to operate effectively in a wide range of applications.

Technology: BIPOLAR

The bipolar technology used in this operational amplifier offers high precision, low noise, and excellent stability, making it a reliable choice for various analog signal processing tasks.

Amplifier Type: OPERATIONAL AMPLIFIER

Being designed as an operational amplifier, this product is specifically tailored for linear signal processing tasks such as amplification, filtering, and signal conditioning.

Technical Specifications

Operational Amplifiers (Op Amps) THS4011CDGNG4 attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Architecture:

Voltage Feedback

Technology:

BIPOLAR

Power Supply:

9/32/±4.5/±16 V

Total Functions:

1

Sub-Category:

Operational Amplifiers

Powered:

No

Frequency Compensation:

Yes

Low-Bias:

No

Low-Offset:

No

Micropower:

No

Wideband:

Yes

Programmable Power:

No

Performance Specifications

Nominal Unity Gain Bandwidth:

290 MHz

Nominal Common Mode Rejection Ratio (CMRR ):

110 dB

Minimum Common Mode Rejection Ratio (CMRR ):

82 dB

Input Offset Voltage Limit:

8000 uV

Minimum Voltage Gain:

5000

Minimum Slew Rate:

300 V/us

Nominal Slew Rate:

310 V/us

Maximum Input Offset Current (IIO):

250 nA

Peak Bias Current:

8 uA

Maximum Bias Current (IIB) @25 °C:

6 uA

Operational Characteristics

Nominal Supply Voltage:

15 V

Maximum Supply Voltage:

16.5 V

Maximum Negative Supply Voltage:

-15 V

Minimum Negative Supply Voltage:

-16.5 V

Lowest Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Supply Current:

9.5 mA

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Nickel/Palladium/Gold/Silver

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Packaging and Shipping

Packing Method:

Tube

Package Code:

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.19

Trade Compliance

THS4011CDGNG4 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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