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THS3121IDGNR

Texas Instruments

THS3121IDGNR by Texas Instruments

THS3121IDGNR by Texas Instruments is an operational amplifier with a small outline package and dual terminal position. It features a max seated height of 1.07mm, 0.65mm terminal pitch, and industrial temperature grade. Ideal for applications requiring high-performance amplification in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,232 parts In-Stock

1+ parts

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5,232

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Digiode

USA . 1,575 parts In-Stock

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1,575

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,444 parts In-Stock

1+ parts

$3.552

100+ parts

-

1k+ parts

$4.075

10k+ parts

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1,444

$3.552

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$4.075

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DigiPath Technology Company

USA . 655 parts In-Stock

1+ parts

$3.911

100+ parts

$3.598

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-

10k+ parts

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655

$3.911

$3.598

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ChromeModa Solutions

Germany . 3,041 parts In-Stock

1+ parts

$3.991

100+ parts

$3.273

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3,041

$3.991

$3.273

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IDEA Electronic Components Group

UK . 2,340 parts In-Stock

1+ parts

$3.991

100+ parts

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$3.592

10k+ parts

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2,340

$3.991

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$3.592

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AZTECH Wire

Italy . 661 parts In-Stock

1+ parts

$7.056

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661

$7.056

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Ampacity Inc.

Singapore . 1,022 parts In-Stock

1+ parts

$7.410

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1,022

$7.410

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One Stop Electronics

USA . 1,451 parts In-Stock

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$8.410

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1,451

$8.410

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A-Z Elektronik GmbH

Germany . 5,181 parts In-Stock

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5,181

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Corphita

USA . 2,074 parts In-Stock

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2,074

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Kepictronics

USA . 1,792 parts In-Stock

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1,792

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Aranea Global

USA . 500 parts In-Stock

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500

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Microchip USA

USA . 453 parts In-Stock

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453

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Overview

Elevate your design with the THS3121IDGNR operational amplifier by Texas Instruments. Known for their exceptional quality and reliability, Texas Instruments amplifiers are trusted by engineers worldwide. Ideal for a wide range of applications, this compact op amp offers unmatched performance and precision. Experience the value of superior signal processing, improved efficiency, and enhanced functionality in your projects. Upgrade to Texas Instruments and unlock the potential of your designs today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provide durability and protection for the internal components of the operational amplifier, ensuring its longevity and reliability.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Package Shape: SQUARE

Square package shape facilitates easy placement on circuit boards and efficient use of space.

No. of Terminals: 8

Having 8 terminals provides flexibility for various connections and configurations in circuit designs.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The combination of small outline, heat sink/slug, thin profile, and shrink pitch design elements enhances heat dissipation, space efficiency, and overall performance of the operational amplifier.

Terminal Position: DUAL

Dual terminal position allows for multiple connections and versatile circuit integration.

Maximum Seated Height: 1.07 mm

Low seated height enables compact and streamlined circuit board design.

Width: 3 mm

Narrow width contributes to space-saving and efficient layout on circuit boards.

Length: 3 mm

Compact length helps in accommodating the operational amplifier in tight spaces and dense circuit arrangements.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in various operating environments and conditions.

Terminal Form: GULL WING

Gull wing terminal form facilitates secure soldering and connection to the circuit board, enhancing stability and reliability.

Amplifier Type: OPERATIONAL AMPLIFIER

Being an operational amplifier, this product is suitable for a wide range of signal processing applications, providing accurate amplification and signal conditioning.

Terminal Pitch: 0.65 mm

Close terminal pitch allows for high-density circuit designs and precise interconnections, enhancing overall performance and reliability.

Technical Specifications

Operational Amplifiers (Op Amps) THS3121IDGNR attributes and parameters. Explore more Operational Amplifiers (Op Amps) devices from Texas Instruments

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Operational Amplifiers

Physical Characteristics

Length:

0.118 in (3 mm)

Width:

0.118 in (3 mm)

Maximum Seated Height:

0.042 in (1.07 mm)

Total Terminals:

8

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

Trade Compliance

THS3121IDGNR Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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