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TGS2304-SCC

Texas Instruments

TGS2304-SCC by Texas Instruments

TGS2304-SCC by Texas Instruments is an SP4T RF switch with max input power of 33.01 dBm and VSWR of 1.2. Operating from 0-20000 MHz, it's ideal for RF/Microwave applications requiring high power handling and low insertion loss.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,759 parts In-Stock

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3,759

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Vyrian

USA . 3,301 parts In-Stock

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3,301

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Sensible Micro Corp

USA . 12 parts In-Stock

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12

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Distributors (Availability)

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Parana Technologies

USA . 1,161 parts In-Stock

1+ parts

$1.868

100+ parts

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$2.414

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1,161

$1.868

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$2.414

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DigiPath Technology Company

USA . 462 parts In-Stock

1+ parts

$2.057

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$1.892

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462

$2.057

$1.892

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ChromeModa Solutions

Germany . 3,953 parts In-Stock

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$2.099

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$1.721

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3,953

$2.099

$1.721

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IDEA Electronic Components Group

UK . 1,217 parts In-Stock

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$2.099

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$1.889

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1,217

$2.099

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$1.889

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AZTECH Wire

Italy . 440 parts In-Stock

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$4.962

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440

$4.962

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One Stop Electronics

USA . 568 parts In-Stock

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$24.000

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568

$24.000

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Corphita

USA . 936 parts In-Stock

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936

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Perfect Parts

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560

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Overview

Experience superior performance and reliability with the TGS2304-SCC RF/Microwave Switch by Texas Instruments. Known for their cutting-edge technology and innovation, Texas Instruments delivers high-quality components that exceed industry standards. Ideal for a wide range of applications, this SP4T switch offers seamless switching between signals with a maximum input power of 33.01 dBm and a low voltage standing wave ratio of 1.2. Enhance your systems with the TGS2304-SCC and unlock new possibilities in RF and microwave communications.

Feature Benefit Bullets

Maximum Input Power (CW): 33.01 dBm

With a high maximum input power, this RF/Microwave switch can handle a strong input signal without experiencing power loss or damage.

Maximum Voltage Standing Wave Ratio: 1.2

A low VSWR of 1.2 indicates excellent impedance matching, resulting in minimal signal reflections and maximum power transfer efficiency.

Construction: COMPONENT

Being a component-level device allows for easy integration into various RF/microwave systems, offering flexibility and customization options.

RF or Microwave Device Type: SP4T

The SP4T configuration provides four separate signal paths, enabling efficient switching between different RF/microwave sources or loads.

Minimum Operating Frequency: 0 MHz

With a starting frequency of 0 MHz, this RF/microwave switch is suitable for a wide range of applications, including DC and low-frequency signals.

Maximum Operating Frequency: 20000 MHz

Capable of operating up to 20 GHz, this switch is suitable for high-frequency RF/microwave signals commonly used in modern communication and radar systems.

Technical Specifications

RF/Microwave Switches TGS2304-SCC attributes and parameters. Explore more RF/Microwave Switches devices from Texas Instruments

Specs

Construction:

COMPONENT

Maximum Input Power (CW):

33.01 dBm

Maximum Operating Frequency:

20000 MHz

Minimum Operating Frequency:

0 MHz

RF or Microwave Device Type:

Maximum Voltage Standing Wave Ratio:

1.2

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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