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TFB2011PCM

Texas Instruments

TFB2011PCM by Texas Instruments

TFB2011PCM by Texas Instruments is a System Interface Logic IC with 160 terminals in a square flatpack package. It features BICMOS technology, gull wing terminals, and 0.635 mm pitch. Ideal for applications requiring bus arbitration and continuous signal generation in electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,370 parts In-Stock

1+ parts

-

100+ parts

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3,370

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Digiode

USA . 762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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762

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 539 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

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539

$2.000

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AZTECH Wire

Italy . 451 parts In-Stock

1+ parts

$4.980

100+ parts

-

1k+ parts

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10k+ parts

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451

$4.980

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Parana Technologies

USA . 1,155 parts In-Stock

1+ parts

$34.891

100+ parts

-

1k+ parts

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10k+ parts

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1,155

$34.891

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ChromeModa Solutions

Germany . 2,093 parts In-Stock

1+ parts

$39.203

100+ parts

$32.146

1k+ parts

-

10k+ parts

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2,093

$39.203

$32.146

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IDEA Electronic Components Group

UK . 1,386 parts In-Stock

1+ parts

$39.203

100+ parts

$37.243

1k+ parts

$35.283

10k+ parts

-

1,386

$39.203

$37.243

$35.283

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Corohmni

South Africa . 2,667 parts In-Stock

1+ parts

$84.638

100+ parts

-

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2,667

$84.638

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Corphita

USA . 4,189 parts In-Stock

1+ parts

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4,189

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DigiPath Technology Company

USA . 1,092 parts In-Stock

1+ parts

-

100+ parts

$35.345

1k+ parts

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10k+ parts

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1,092

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$35.345

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Overview

Discover the ultimate solution for your system interface needs with the TFB2011PCM by Texas Instruments. This high-quality logic IC offers unmatched performance and reliability, perfect for a wide range of applications. Whether you're looking for a bus arbiter or continuous signal generator, this product has got you covered. With its advanced BICMOS technology and innovative design, you can trust that your system will operate smoothly and efficiently. Upgrade your setup today and experience the value and benefits that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape helps in efficient utilization of space on the PCB, making it suitable for compact designs.

No. of Terminals: 160

Having 160 terminals provide a higher level of connectivity and functionality, making it suitable for complex circuit applications.

Package Style (Meter): FLATPACK

The flatpack style offers a low profile design, saving vertical space on the PCB and enabling a more compact overall system layout.

Terminal Position: QUAD

Quad terminal position provides stability and facilitates efficient soldering, ensuring a reliable electrical connection.

Peripheral IC Type: SYSTEM INTERFACE LOGIC, BUS ARBITER AND CONTINUOUS SIGNAL GENERATOR

This versatile IC type functions as a system interface logic, bus arbiter, and continuous signal generator, providing a comprehensive solution for various system integration needs.

Technology: BICMOS

BICMOS technology offers a balance between bipolar and CMOS technologies, delivering high speed, low power consumption, and robust performance.

Terminal Form: GULL WING

Gull wing terminal form ensures secure attachment to the PCB, enhancing the product's durability and reliability.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch supports high-density mounting, enabling the product to accommodate a large number of terminals in a compact space.

Technical Specifications

System Interface Logic ICs TFB2011PCM attributes and parameters. Explore more System Interface Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G160

No. of Terminals:

160

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP160,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Sub-Category:

System Interface Logic

Surface Mount:

YES

Technology:

BICMOS

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Trade Compliance

TFB2011PCM Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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