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TDP0604RNQR

Texas Instruments

TDP0604RNQR by Texas Instruments

TDP0604RNQR by Texas Instruments is a 40-terminal consumer IC in a rectangular chip carrier package. With a temperature range of 0-70°C, it operates on -0.5 to 4V supply voltage and has 4 channels. Ideal for applications requiring thin profile ICs with surface mount capability.

Median Price

$5.630

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,408 parts In-Stock

1+ parts

$3.741

100+ parts

$3.050

1k+ parts

$2.033

10k+ parts

-

13,408

$3.741

$3.050

$2.033

-

DigiKey

USA . 5,792 parts In-Stock

1+ parts

$5.630

100+ parts

$3.616

1k+ parts

$3.252

10k+ parts

$3.146

5,792

$5.630

$3.616

$3.252

$3.146

Mouser Electronics

USA . 1,654 parts In-Stock

1+ parts

$5.630

100+ parts

$3.620

1k+ parts

$3.260

10k+ parts

$3.140

1,654

$5.630

$3.620

$3.260

$3.140

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,201 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

-

10k+ parts

-

2,201

$2.540

-

-

-

Digiode

USA . 3,801 parts In-Stock

1+ parts

$3.554

100+ parts

-

1k+ parts

-

10k+ parts

-

3,801

$3.554

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,207 parts In-Stock

1+ parts

$2.160

100+ parts

-

1k+ parts

-

10k+ parts

-

6,207

$2.160

-

-

-

Semicontronic

India . 6,032 parts In-Stock

1+ parts

$2.160

100+ parts

$2.106

1k+ parts

$2.095

10k+ parts

-

6,032

$2.160

$2.106

$2.095

-

Parana Technologies

USA . 1,920 parts In-Stock

1+ parts

$2.265

100+ parts

-

1k+ parts

$2.766

10k+ parts

-

1,920

$2.265

-

$2.766

-

DigiPath Technology Company

USA . 1,980 parts In-Stock

1+ parts

$2.494

100+ parts

-

1k+ parts

-

10k+ parts

-

1,980

$2.494

-

-

-

Corohmni

South Africa . 461 parts In-Stock

1+ parts

$2.540

100+ parts

-

1k+ parts

-

10k+ parts

-

461

$2.540

-

-

-

ChromeModa Solutions

Germany . 2,279 parts In-Stock

1+ parts

$2.545

100+ parts

$2.087

1k+ parts

-

10k+ parts

-

2,279

$2.545

$2.087

-

-

IDEA Electronic Components Group

UK . 196 parts In-Stock

1+ parts

$2.545

100+ parts

-

1k+ parts

$2.290

10k+ parts

-

196

$2.545

-

$2.290

-

Corphita

USA . 1,023 parts In-Stock

1+ parts

$3.367

100+ parts

-

1k+ parts

-

10k+ parts

-

1,023

$3.367

-

-

-

Overview

Experience cutting-edge technology with the TDP0604RNQR by Texas Instruments, a high-quality consumer IC that offers unmatched performance and reliability. Designed with precision and expertise, this product is versatile and adaptable for a wide range of applications in various industries. With advanced features and innovative design, it provides customers with value, benefits, and advantages that exceed expectations. Upgrade your projects with the TDP0604RNQR and discover the endless possibilities it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides good insulation and protection for the IC, making it durable and reliable.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCBs.

Package Shape: RECTANGULAR

Rectangular shape makes it easier to handle and integrate into electronic systems.

General IC Type: CONSUMER CIRCUIT

Designed for consumer applications, ensuring compatibility with a wide range of devices.

No. of Terminals: 40

Having a higher number of terminals allows for more connectivity options and functions.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles provide flexibility in design and application, accommodating different requirements.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even under demanding conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in various environments and applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides corrosion resistance and reliable connections for the terminals.

Terminal Position: QUAD

Quad terminal position offers efficient layout and connectivity for the IC on PCBs.

Maximum Seated Height: 0.8 mm

Low seated height enables slim and compact designs for electronic devices.

Width: 4 mm

Compact width allows for space-saving integration of the IC in electronic systems.

Minimum Supply Voltage (Vsup): -0.5 V

Negative supply voltage support provides versatility in powering options for the IC.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and reliability during assembly.

Length: 6 mm

Moderate length provides a balance between space-saving and easy handling during installation.

No. of Channels: 4

Multiple channels offer versatility in signal processing and connectivity for diverse applications.

Terminal Form: NO LEAD

Lead-free terminal form ensures compliance with environmental regulations and safety standards.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and compact PCB designs.

Maximum Supply Voltage (Vsup): 4 V

High maximum supply voltage supports a wide range of applications and power requirements.

Technical Specifications

Other Function Consumer ICs TDP0604RNQR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,24X16,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

4 V

Minimum Supply Voltage (Vsup):

-.5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TDP0604RNQR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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