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TDP0604IRNQT

Texas Instruments

TDP0604IRNQT by Texas Instruments

TDP0604IRNQT by Texas Instruments is a 40-terminal consumer IC with a package style of chip carrier. It operates b/w -40°C to 85°C, suitable for various consumer circuit applications. With a compact size of 6mm x 4mm and surface mount capability, it offers flexibility in design and assembly processes.

Median Price

$5.926

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 16,182 parts In-Stock

1+ parts

$5.051

100+ parts

$4.118

1k+ parts

$2.745

10k+ parts

-

16,182

$5.051

$4.118

$2.745

-

Mouser Electronics

USA . 18 parts In-Stock

1+ parts

$6.800

100+ parts

$5.660

1k+ parts

$4.280

10k+ parts

-

18

$6.800

$5.660

$4.280

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,038 parts In-Stock

1+ parts

$4.798

100+ parts

-

1k+ parts

-

10k+ parts

-

4,038

$4.798

-

-

-

Vyrian

USA . 3,783 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,783

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,126 parts In-Stock

1+ parts

$3.002

100+ parts

-

1k+ parts

$3.508

10k+ parts

-

1,126

$3.002

-

$3.508

-

DigiPath Technology Company

USA . 2,347 parts In-Stock

1+ parts

$3.306

100+ parts

-

1k+ parts

-

10k+ parts

-

2,347

$3.306

-

-

-

ChromeModa Solutions

Germany . 4,679 parts In-Stock

1+ parts

$3.373

100+ parts

$2.766

1k+ parts

-

10k+ parts

-

4,679

$3.373

$2.766

-

-

IDEA Electronic Components Group

UK . 1,559 parts In-Stock

1+ parts

$3.373

100+ parts

-

1k+ parts

$3.036

10k+ parts

-

1,559

$3.373

-

$3.036

-

Corohmni

South Africa . 151 parts In-Stock

1+ parts

$3.740

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$3.740

-

-

-

Semicontronic

India . 8,083 parts In-Stock

1+ parts

$4.290

100+ parts

$4.183

1k+ parts

$4.161

10k+ parts

-

8,083

$4.290

$4.183

$4.161

-

Ampacity Inc.

Singapore . 8,022 parts In-Stock

1+ parts

$4.290

100+ parts

-

1k+ parts

-

10k+ parts

-

8,022

$4.290

-

-

-

Corphita

USA . 1,920 parts In-Stock

1+ parts

$4.546

100+ parts

-

1k+ parts

-

10k+ parts

-

1,920

$4.546

-

-

-

Microchip USA

USA . 1,119 parts In-Stock

1+ parts

$28.710

100+ parts

$28.530

1k+ parts

$28.440

10k+ parts

$28.350

1,119

$28.710

$28.530

$28.440

$28.350

Overview

Unlock the potential of your consumer electronic devices with the TDP0604IRNQT by Texas Instruments. Manufactured with superior quality and precision, this chip carrier offers unmatched performance and reliability in various applications. With its compact design and advanced technology, this consumer circuit IC provides customers with value, efficiency, and innovation. Experience seamless operation and enhanced functionality with the TDP0604IRNQT, making it the perfect choice for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for consumer electronic applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and enabling high volume production.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate the IC into various electronic devices and ensures compatibility with standard mounting techniques.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand demanding usage conditions without overheating.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliability and functionality even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish ensures good electrical conductivity and corrosion resistance for long-lasting performance.

Length: 6 mm

Compact length allows for space-saving integration into small electronic devices without compromising functionality.

No. of Channels: 4

The multiple channels enable versatile functionality and signal processing capabilities, making this IC suitable for a variety of applications.

Maximum Supply Voltage (Vsup): 4 V

The high maximum supply voltage allows for compatibility with different power sources and ensures reliable operation within specified limits.

Technical Specifications

Other Function Consumer ICs TDP0604IRNQT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,24X16,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

4 V

Minimum Supply Voltage (Vsup):

-.5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TDP0604IRNQT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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