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TAS5630PHDR

Texas Instruments

TAS5630PHDR by Texas Instruments

TAS5630PHDR by Texas Instruments is a 2-channel audio amplifier with 300W output power. Operating b/w 0-70°C, it has a supply voltage range of 10.8-13.2V and gain of 23dB. Ideal for audio applications requiring high power amplification in compact setups due to its small form factor and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,969 parts In-Stock

1+ parts

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4,969

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Vyrian

USA . 2,291 parts In-Stock

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2,291

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Chip Stock

USA . 620 parts In-Stock

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620

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,091 parts In-Stock

1+ parts

$2.859

100+ parts

-

1k+ parts

$3.349

10k+ parts

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1,091

$2.859

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$3.349

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DigiPath Technology Company

USA . 2,119 parts In-Stock

1+ parts

$3.148

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2,119

$3.148

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ChromeModa Solutions

Germany . 4,006 parts In-Stock

1+ parts

$3.212

100+ parts

$2.634

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4,006

$3.212

$2.634

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IDEA Electronic Components Group

UK . 501 parts In-Stock

1+ parts

$3.212

100+ parts

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$2.891

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501

$3.212

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$2.891

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$4.622

100+ parts

$4.206

1k+ parts

$3.790

10k+ parts

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450

$4.622

$4.206

$3.790

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AZTECH Wire

Italy . 781 parts In-Stock

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$8.361

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781

$8.361

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One Stop Electronics

USA . 1,374 parts In-Stock

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$12.800

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1,374

$12.800

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Microchip USA

USA . 377 parts In-Stock

1+ parts

$41.430

100+ parts

$40.840

1k+ parts

$40.540

10k+ parts

$40.250

377

$41.430

$40.840

$40.540

$40.250

Component Stockers USA

USA . 754 parts In-Stock

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$99.990

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754

$99.990

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Perfect Parts

USA . 3,196 parts In-Stock

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3,196

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Corphita

USA . 2,418 parts In-Stock

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Overview

Experience unparalleled audio quality with the TAS5630PHDR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch audio and video amplifiers that cater to a wide range of applications. The TAS5630PHDR offers customers exceptional value, benefits, and advantages, making it the perfect choice for all your audio amplification needs. Upgrade your sound system today and immerse yourself in crystal clear, powerful sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for electronic components.

Surface Mount: YES

Easy to install and saves space on PCB.

No. of Terminals: 64

Plenty of terminals for connecting various components.

Nominal Output Power: 300 W

High output power for driving speakers with clarity and volume.

Minimum Supply Voltage (Vsup): 10.8 V

Lower minimum supply voltage for energy efficiency.

Maximum Operating Temperature: 70 °C

Can operate efficiently even in high temperature environments.

Nominal Bandwidth: 0.08 kHz

Wide bandwidth for accurate sound reproduction.

Gain: 23 dB

High gain for amplifying audio signals effectively.

Technical Specifications

Audio & Video Amplifiers TAS5630PHDR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.08 kHz

General IC Type:

Gain:

23 dB

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

5A

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

300 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12,50

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Voltage (Vsup):

13.2 V

Minimum Supply Voltage (Vsup):

10.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

TAS5630PHDR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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