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TAS5614LADDVEVM

Texas Instruments

TAS5614LADDVEVM by Texas Instruments

TAS5614LADDVEVM by Texas Instruments is an Audio Amplifier Evaluation Board with Class D amplifier type. It offers 300W x 1 @ 2Ohm or 150W x 2 @ 4Ohm output power. Operating at a supply voltage of 12V to 38V, it is ideal for high-power audio applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,214 parts In-Stock

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Digiode

USA . 2,137 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 852 parts In-Stock

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$5.971

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852

$5.971

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One Stop Electronics

USA . 321 parts In-Stock

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$86.100

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$86.100

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Ampacity Inc.

Singapore . 446 parts In-Stock

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$128.100

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446

$128.100

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Semicontronic

India . 214 parts In-Stock

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$218.100

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$212.648

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$211.557

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214

$218.100

$212.648

$211.557

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ChromeModa Solutions

Germany . 3,488 parts In-Stock

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DigiPath Technology Company

USA . 2,170 parts In-Stock

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Corphita

USA . 1,930 parts In-Stock

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IDEA Electronic Components Group

UK . 643 parts In-Stock

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Parana Technologies

USA . 425 parts In-Stock

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$1.267

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425

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$1.267

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Corohmni

South Africa . 272 parts In-Stock

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Overview

Experience superior audio performance with the TAS5614LADDVEVM by Texas Instruments. Known for their high-quality manufacturing, Texas Instruments delivers reliable and innovative solutions in the development board category. This Audio Amplifier Evaluation Board is perfect for a range of applications, offering customers unmatched value and benefits. Whether you're looking for a mono or stereo output, this Class D amplifier provides up to 300W x 1 @ 2Ohm or 150W x 2 @ 4Ohm, making it a versatile choice for your audio needs. Elevate your projects with the TAS5614LADDVEVM and enjoy exceptional sound quality like never before.

Feature Benefit Bullets

Series: PurePath™ HD

Provides high quality audio output with minimal distortion for an immersive listening experience.

Amplifier Type: Class D

Efficient power utilization and low heat generation, making it ideal for compact audio systems.

Max Output Power x Channels @ Load: 300W x 1 @ 2Ohm; 150W x 2 @ 4Ohm

Delivers high power output suitable for driving speakers with varying impedance levels.

Voltage - Supply: 12V ~ 38V

Versatile power supply range allows compatibility with a wide range of audio systems.

Board Type: Fully Populated

Ready-to-use evaluation board that simplifies the testing and integration process.

Utilized IC / Part: TAS5614LA

High-quality integrated circuit specifically designed for audio amplification, ensuring premium sound quality.

Supplied Contents: Board(s), Cable(s)

Includes essential components for immediate setup and testing, saving time and effort.

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Suitable for use in various environments without worrying about moisture damage.

Technical Specifications

Additional Parts TAS5614LADDVEVM attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Category:

Development Boards, Kits, Programmers
Evaluation Boards Audio Amplifier Evaluation Boards

Output Type:

1-Channel (Mono) or 2-Channel (Stereo)

Max Output Power x Channels @ Load:

300W x 1 @ 2Ohm; 150W x 2 @ 4Ohm

Standard Package:

1

Series:

PurePath™ HD

Supplied Contents:

Board(s), Cable(s)

Voltage - Supply:

12V ~ 38V

Board Type:

Fully Populated

Utilized IC / Part:

TAS5614LA

Package:

Box

Amplifier Type:

Class D

Base Product Number:

TAS561

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

TAS5614LADDVEVM Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8473.30.1180

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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