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TAS3002PFBG4

Texas Instruments

TAS3002PFBG4 by Texas Instruments

TAS3002PFBG4 by Texas Instruments is a 48-terminal consumer IC with 3.3V power supply, operating b/w 0-70°C. It features a flatpack package style suitable for various consumer circuit applications requiring a min supply voltage of 3V and max seated height of 1.2mm.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,759 parts In-Stock

1+ parts

-

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2,759

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Digiode

USA . 2,205 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,205

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Connect4Technologies Inc.

Canada . 190 parts In-Stock

1+ parts

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190

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 466 parts In-Stock

1+ parts

$1.634

100+ parts

-

1k+ parts

$2.254

10k+ parts

-

466

$1.634

-

$2.254

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ChromeModa Solutions

Germany . 4,741 parts In-Stock

1+ parts

$1.836

100+ parts

$1.506

1k+ parts

-

10k+ parts

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4,741

$1.836

$1.506

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IDEA Electronic Components Group

UK . 1,328 parts In-Stock

1+ parts

$1.836

100+ parts

-

1k+ parts

$1.652

10k+ parts

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1,328

$1.836

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$1.652

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One Stop Electronics

USA . 805 parts In-Stock

1+ parts

$9.800

100+ parts

-

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805

$9.800

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AZTECH Wire

Italy . 730 parts In-Stock

1+ parts

$17.864

100+ parts

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730

$17.864

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Corphita

USA . 3,661 parts In-Stock

1+ parts

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3,661

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DigiPath Technology Company

USA . 1,061 parts In-Stock

1+ parts

-

100+ parts

$1.655

1k+ parts

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1,061

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$1.655

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Microchip USA

USA . 161 parts In-Stock

1+ parts

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161

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Overview

Enhance your consumer electronics with the TAS3002PFBG4 by Texas Instruments, a high-quality consumer circuit that offers unmatched performance and reliability. Designed with precision and expertise, this IC delivers exceptional value and benefits to customers in various applications. Whether you're looking to upgrade your audio systems or enhance your smart devices, the TAS3002PFBG4 is the perfect choice. Trust Texas Instruments for top-notch quality and innovation in consumer ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers durability and protection for the IC, ensuring long-lasting performance.

Surface Mount: YES

Surface mount design allows for easy and efficient installation on circuit boards.

Power Supplies (V): 3.3

Operating at 3.3V provides optimal power efficiency for consumer applications.

No. of Terminals: 48

With 48 terminals, this IC offers versatility and connectivity options for various circuit configurations.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand high temperature environments.

Minimum Operating Temperature: 0 °C

Operating down to 0°C ensures functionality in a wide range of temperature conditions.

Terminal Position: QUAD

The QUAD terminal position allows for efficient signal routing and connectivity within the circuit.

Width: 7 mm

A compact width of 7mm enables space-saving integration in consumer electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The IC can handle peak reflow temperatures for up to 30 seconds, ensuring reliable solder connections during assembly.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates the IC is moderately sensitive to moisture, suitable for standard manufacturing processes.

Technical Specifications

Other Function Consumer ICs TAS3002PFBG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

TAS3002PFBG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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