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SP1202S02RB-PCB/NOPB

Texas Instruments

SP1202S02RB-PCB/NOPB by Texas Instruments

SP1202S02RB-PCB/NOPB by Texas Instruments is an 8-MSOP interface board for sensor to ADC connection. It is part of the WEBENCH® Buildit Board series, designed for thermocouple applications. The unpopulated bulk package includes evaluation boards for Development Kits and Programmers.

Median Price

$29.030

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 12 parts In-Stock

1+ parts

$29.030

100+ parts

-

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12

$29.030

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 457 parts In-Stock

1+ parts

$26.486

100+ parts

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457

$26.486

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Vyrian

USA . 6,927 parts In-Stock

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6,927

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 12 parts In-Stock

1+ parts

$23.700

100+ parts

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12

$23.700

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Semicontronic

India . 12 parts In-Stock

1+ parts

$23.700

100+ parts

$23.108

1k+ parts

$22.989

10k+ parts

-

12

$23.700

$23.108

$22.989

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Corphita

USA . 2,726 parts In-Stock

1+ parts

$25.092

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2,726

$25.092

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Corohmni

South Africa . 142 parts In-Stock

1+ parts

$27.880

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142

$27.880

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ChromeModa Solutions

Germany . 5,736 parts In-Stock

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5,736

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Parana Technologies

USA . 1,868 parts In-Stock

1+ parts

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$0.494

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1,868

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$0.494

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DigiPath Technology Company

USA . 557 parts In-Stock

1+ parts

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557

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IDEA Electronic Components Group

UK . 429 parts In-Stock

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429

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Perfect Parts

USA . 17 parts In-Stock

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Overview

The SP1202S02RB-PCB/NOPB by Texas Instruments is a top-quality sensor to ADC interface with endless possibilities. With Texas Instruments' reputation for excellence in manufacturing, this development board offers unmatched reliability and performance. Ideal for applications in the fields of IoT, industrial automation, and consumer electronics, this product provides unparalleled value and benefits to customers looking for seamless sensor integration and accurate data acquisition. Experience the advantages of the SP1202S02RB-PCB/NOPB and take your projects to the next level with ease.

Feature Benefit Bullets

Other Names: SP1202S02RB-PCB

Easy to identify and search for in the market

Category: Development Boards, Kits, Programmers

Designed for development and testing purposes

Series: WEBENCH® Buildit Board

Part of a reputable series known for quality and reliability

Package: Bulk

Convenient packaging for multiple units at once

Type: Interface

Facilitates communication between sensor and ADC

Function: Sensor to ADC Interface, Thermocouple

Specifically designed for connecting sensors to ADCs and monitoring thermocouples

Utilized IC / Part: 8-MSOP

Utilizes an industry-standard 8-MSOP component for compatibility

Supplied Contents: Unpopulated (Bare) Board(s)

Provides flexibility for customization and specific component placement

Base Product Number: SP120

Belongs to a established product line known for quality and performance

Moisture Sensitivity Level (MSL): 1 (Unlimited)

Can be stored in various environments without concern for moisture damage

Technical Specifications

Additional Parts SP1202S02RB-PCB/NOPB attributes and parameters. Explore more Additional Parts devices from Texas Instruments

Technical Specifications

Other Names:

SP1202S02RB-PCB
SP1202S02RBPCBNOPB
551600265-001
SP1202S02RB-PCB-ND
551600265-001-ND

Series:

WEBENCH® Buildit Board

Function:

Sensor to ADC Interface, Thermocouple

Type:

Interface

Category:

Development Boards, Kits, Programmers
Evaluation Boards Evaluation and Demonstration Boards and Kits

Supplied Contents:

Unpopulated (Bare) Board(s)

Utilized IC / Part:

8-MSOP

Package:

Bulk

Embedded:

No

Standard Package:

1

Base Product Number:

SP120

Moisture Sensitivity Level (MSL):

1 (Unlimited)

Trade Compliance

SP1202S02RB-PCB/NOPB Miscellaneous Components trade compliance attributes, and parameters.

ECCN

EAR99

HTS

8534.00.0040

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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