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SNJ54AC11000FK

Texas Instruments

SNJ54AC11000FK by Texas Instruments

SNJ54AC11000FK by Texas Instruments is a CMOS logic gate with 20 terminals, operating at temperatures from -55°C to 125°C. It supports power supplies of 3.3V/5V and is designed for military-grade applications. This chip carrier package has a ceramic body material and is surface-mountable, making it suitable for high-reliability electronic systems.

Median Price

$24.750

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 28 parts In-Stock

1+ parts

-

100+ parts

$22.000

1k+ parts

$19.690

10k+ parts

$18.530

28

-

$22.000

$19.690

$18.530

DigiKey

USA . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

Verical

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$27.500

1k+ parts

$24.613

10k+ parts

$23.163

25

-

$27.500

$24.613

$23.163

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,455 parts In-Stock

1+ parts

$23.218

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

$23.218

-

-

-

Vyrian

USA . 6,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,592

-

-

-

-

DigiKey Marketplace

USA . 28 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,067 parts In-Stock

1+ parts

$21.285

100+ parts

-

1k+ parts

$21.598

10k+ parts

-

2,067

$21.285

-

$21.598

-

Corphita

USA . 161 parts In-Stock

1+ parts

$21.996

100+ parts

-

1k+ parts

-

10k+ parts

-

161

$21.996

-

-

-

IDEA Electronic Components Group

UK . 562 parts In-Stock

1+ parts

$23.916

100+ parts

$22.720

1k+ parts

$21.524

10k+ parts

-

562

$23.916

$22.720

$21.524

-

ChromeModa Solutions

Germany . 121 parts In-Stock

1+ parts

$23.916

100+ parts

$19.611

1k+ parts

-

10k+ parts

-

121

$23.916

$19.611

-

-

Microchip USA

USA . 1,024 parts In-Stock

1+ parts

$53.960

100+ parts

$53.020

1k+ parts

$52.550

10k+ parts

$52.080

1,024

$53.960

$53.020

$52.550

$52.080

DigiPath Technology Company

USA . 2,073 parts In-Stock

1+ parts

-

100+ parts

$21.563

1k+ parts

-

10k+ parts

-

2,073

-

$21.563

-

-

Overview

Elevate your electronic projects with the SNJ54AC11000FK by Texas Instruments. With a reputation for high-quality products, Texas Instruments delivers reliable logic gates that cater to a wide range of applications. Designed for military-grade performance, this chip carrier package offers the perfect balance of power supplies at 3.3/5V, making it ideal for demanding environments. Experience the value and benefits of Texas Instruments' cutting-edge technology, providing you with a competitive edge in your projects. Choose excellence, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package body provides excellent thermal conductivity and stability, ensuring reliable operation in high temperature environments.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Screening Level: 38535Q/M;38534H;883B

High screening levels ensure high reliability and performance, making this product suitable for critical applications.

Power Supplies (V): 3.3/5

Support for multiple power supply voltages provides flexibility in designing circuits with different voltage requirements.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and complex logic operations in a single package.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging style offers compactness and protection, making it suitable for densely populated PCB designs.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -55 °C

The ability to operate at low temperatures makes this product suitable for use in extreme cold environments.

Terminal Position: QUAD

Quad terminal position provides efficient routing of signals and connections, enabling easy integration into circuit designs.

Temperature Grade: MILITARY

Military-grade temperature specifications ensure reliability and performance in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Terminal Form: NO LEAD

No-lead terminal form provides environmental benefits and compliance with RoHS regulations.

Terminal Pitch: 1.27 mm

With a fine terminal pitch, this product allows for high-density mounting and precise signal routing on the PCB.

Technical Specifications

Logic Gates SNJ54AC11000FK attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

JESD-30 Code:

S-XQCC-N20

Logic IC Type:

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Gates

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54AC11000FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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