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SN76477N3

Texas Instruments

SN76477N3 by Texas Instruments

SN76477N3 by Texas Instruments is a Music & Sound Synthesizer IC with 28 terminals in an IN-LINE package. It operates b/w -10°C to 40°C, suitable for commercial applications. This bipolar technology chip is ideal for sound synthesis and music production.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,402 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5,402

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-

-

-

Digiode

USA . 1,478 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,478

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 738 parts In-Stock

1+ parts

$1.145

100+ parts

-

1k+ parts

$1.962

10k+ parts

-

738

$1.145

-

$1.962

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IDEA Electronic Components Group

UK . 2,026 parts In-Stock

1+ parts

$1.287

100+ parts

-

1k+ parts

$1.158

10k+ parts

-

2,026

$1.287

-

$1.158

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ChromeModa Solutions

Germany . 1,749 parts In-Stock

1+ parts

$1.287

100+ parts

$1.055

1k+ parts

-

10k+ parts

-

1,749

$1.287

$1.055

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-

One Stop Electronics

USA . 769 parts In-Stock

1+ parts

$10.800

100+ parts

-

1k+ parts

-

10k+ parts

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769

$10.800

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-

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AZTECH Wire

Italy . 479 parts In-Stock

1+ parts

$14.743

100+ parts

-

1k+ parts

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10k+ parts

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479

$14.743

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-

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DigiPath Technology Company

USA . 2,336 parts In-Stock

1+ parts

-

100+ parts

$1.160

1k+ parts

-

10k+ parts

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2,336

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$1.160

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Corphita

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

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1,645

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Overview

Unleash your creativity with the SN76477N3 Music & Sound Synthesizer IC from Texas Instruments. Designed with high-quality materials and cutting-edge technology, this versatile component offers endless possibilities for audio applications. Whether you're a DIY enthusiast, musician, or sound engineer, this IC will elevate your projects with its reliability and performance. Explore new sounds, create unique melodies, and bring your ideas to life with the SN76477N3 - the perfect tool to enhance your audio experience. Elevate your projects with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the synthesizer IC.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and compatibility with a variety of audio systems and devices.

Maximum Operating Temperature: 40 °C

With a maximum operating temperature of 40°C, this synthesizer IC can handle extended periods of use without overheating.

Technology: BIPOLAR

The use of bipolar technology provides high-performance capabilities and efficient signal processing for high-quality sound synthesis.

Terminal Form: THROUGH-HOLE

The through-hole terminal form simplifies installation and maintenance processes, making it easier to integrate the synthesizer IC into audio systems.

Technical Specifications

Music & Sound Synthesizer ICs SN76477N3 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN76477N3 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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