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SN75LVDT386DGGG4

Texas Instruments

SN75LVDT386DGGG4 by Texas Instruments

SN75LVDT386DGGG4 by Texas Instruments is a 16-function line driver/receiver with 3.6V max supply voltage, operating at -40 to 85°C. It features EIA-644/TIA-644 interface standard, GULL WING terminal form, and differential input characteristics. Ideal for commercial-grade applications requiring high-speed data transmission in compact designs.

Median Price

$16.490

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 12 parts In-Stock

1+ parts

$16.490

100+ parts

$8.440

1k+ parts

-

10k+ parts

-

12

$16.490

$8.440

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,229 parts In-Stock

1+ parts

$10.944

100+ parts

-

1k+ parts

-

10k+ parts

-

3,229

$10.944

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-

-

Vyrian

USA . 6,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,811

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,035 parts In-Stock

1+ parts

$8.696

100+ parts

-

1k+ parts

$9.376

10k+ parts

-

2,035

$8.696

-

$9.376

-

DigiPath Technology Company

USA . 1,812 parts In-Stock

1+ parts

$9.576

100+ parts

$8.810

1k+ parts

-

10k+ parts

-

1,812

$9.576

$8.810

-

-

ChromeModa Solutions

Germany . 6,647 parts In-Stock

1+ parts

$9.771

100+ parts

$8.012

1k+ parts

-

10k+ parts

-

6,647

$9.771

$8.012

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-

IDEA Electronic Components Group

UK . 2,149 parts In-Stock

1+ parts

$9.771

100+ parts

$9.282

1k+ parts

$8.794

10k+ parts

-

2,149

$9.771

$9.282

$8.794

-

Corphita

USA . 2,524 parts In-Stock

1+ parts

$10.368

100+ parts

-

1k+ parts

-

10k+ parts

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2,524

$10.368

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QUARKTWIN TECHNOLOGY LTD

USA . 29,106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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29,106

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Microchip USA

USA . 1,609 parts In-Stock

1+ parts

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100+ parts

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1,609

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Overview

Enhance your electronic designs with the Texas Instruments SN75LVDT386DGGG4 Line Driver & Receiver. Manufactured by a trusted industry leader, this product ensures top-notch quality and reliability. Ideal for a wide range of applications, this component offers unmatched value and benefits to customers seeking high-performance solutions. Experience seamless operation and improved functionality with the SN75LVDT386DGGG4, setting new standards in the field of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material used for the package body provides protection and ensures long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, reducing assembly time and costs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making it versatile for various applications.

No. of Functions: 16

Multiple functions packed into one device offer increased functionality in a compact design.

Maximum Operating Temperature: 70 °C

Capable of operating in high-temperature environments without compromising performance.

Output Polarity: TRUE

Ensures the correct output polarity, which is essential for compatibility with other system components.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient and reliable operation.

Interface Standard: EIA-644; TIA-644

Compliance with industry standards ensures compatibility and interoperability with other devices and systems.

Technical Specifications

Line Drivers & Receivers SN75LVDT386DGGG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00001 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

16

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

8 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

4 ns

Receiver No. of Bits:

16

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN75LVDT386DGGG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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