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SN75LVDS86ADGGRG4

Texas Instruments

SN75LVDS86ADGGRG4 by Texas Instruments

SN75LVDS86ADGGRG4 by Texas Instruments is a 48-terminal line receiver with a supply voltage range of 3-3.6V. It operates at temperatures from 0 to 70°C, has a max receive delay of 7ns, and uses CMOS technology. Ideal for EIA/TIA-644 interfaces in commercial applications requiring differential input characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,041 parts In-Stock

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Digiode

USA . 2,034 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Ampacity Inc.

Singapore . 787 parts In-Stock

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$5.500

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$5.500

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Parana Technologies

USA . 1,842 parts In-Stock

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$5.938

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$6.720

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$6.720

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AZTECH Wire

Italy . 765 parts In-Stock

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$6.270

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$6.270

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IDEA Electronic Components Group

UK . 1,322 parts In-Stock

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$6.672

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$6.005

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ChromeModa Solutions

Germany . 835 parts In-Stock

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$6.672

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$5.471

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$6.672

$5.471

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One Stop Electronics

USA . 1,468 parts In-Stock

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$42.500

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QUARKTWIN TECHNOLOGY LTD

USA . 17,237 parts In-Stock

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Continental Prestige Electronics

USA . 6,604 parts In-Stock

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Argo Parts USA

USA . 4,570 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Microchip USA

USA . 921 parts In-Stock

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DigiPath Technology Company

USA . 594 parts In-Stock

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Corphita

USA . 66 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your electronic designs with the SN75LVDS86ADGGRG4 by Texas Instruments! Crafted with precision and expertise, this Line Driver & Receiver offers unmatched quality and reliability. Perfect for a variety of applications, this product ensures seamless connectivity and superior performance. Experience the value of Texas Instruments' innovative technology and elevate your projects to new heights. Trust in the advantages this product provides, from enhanced efficiency to streamlined operations. Upgrade your systems today with the SN75LVDS86ADGGRG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability provides versatility and compatibility with a wide range of systems and devices.

Package Shape: RECTANGULAR

The rectangular package shape allows for space-efficient PCB layout and integration, making it suitable for compact designs.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V ensures compatibility with common power systems and reduces the need for additional voltage regulation.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can perform reliably in various environmental conditions without overheating.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish ensures reliable electrical connections and corrosion resistance for improved longevity.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency, speed, and noise immunity, making the product suitable for high-performance applications.

Interface Standard: EIA-644; TIA-644

Compliance with EIA-644 and TIA-644 interface standards ensures interoperability with other compatible devices and systems, facilitating seamless communication.

Technical Specifications

Line Drivers & Receivers SN75LVDS86ADGGRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

7 ns

Receiver No. of Bits:

3

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

SN75LVDS86ADGGRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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