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SN75LVDS84DGGRG4

Texas Instruments

SN75LVDS84DGGRG4 by Texas Instruments

SN75LVDS84DGGRG4 by Texas Instruments is a 48-terminal line driver with a supply voltage of 3.3V, operating b/w 0-70°C. It features totem-pole output, EIA-644/TIA-644 interface standard, and differential output for commercial applications requiring high-speed data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,932 parts In-Stock

1+ parts

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8,932

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Digiode

USA . 2,166 parts In-Stock

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2,166

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Chip Stock

USA . 155 parts In-Stock

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155

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 184 parts In-Stock

1+ parts

$4.616

100+ parts

-

1k+ parts

$5.085

10k+ parts

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184

$4.616

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$5.085

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DigiPath Technology Company

USA . 568 parts In-Stock

1+ parts

$5.082

100+ parts

$4.676

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-

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568

$5.082

$4.676

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ChromeModa Solutions

Germany . 2,624 parts In-Stock

1+ parts

$5.186

100+ parts

$4.253

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2,624

$5.186

$4.253

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IDEA Electronic Components Group

UK . 243 parts In-Stock

1+ parts

$5.186

100+ parts

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$4.667

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243

$5.186

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$4.667

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AZTECH Wire

Italy . 450 parts In-Stock

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$8.013

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450

$8.013

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One Stop Electronics

USA . 1,086 parts In-Stock

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$37.500

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1,086

$37.500

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Component Stockers USA

USA . 529 parts In-Stock

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$99.990

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529

$99.990

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Microchip USA

USA . 1,945 parts In-Stock

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1,945

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Corphita

USA . 1,871 parts In-Stock

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1,871

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Overview

Enhance your electronic designs with the SN75LVDS84DGGRG4 by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers exceptional line drivers & receivers like this one. Ideal for various applications, this product offers unmatched value and benefits to customers. Experience reliable performance, efficiency, and versatility with the SN75LVDS84DGGRG4. Choose Texas Instruments for superior technology solutions that meet your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides sturdy construction and good protection for the internal components of the product.

Surface Mount: YES

Surface mount capability makes it easy to integrate this product into various electronic devices without the need for through-hole mounting.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for compatibility with a wider range of power sources and ensures stable performance under varying voltage conditions.

Output Polarity: TRUE

True output polarity ensures accurate signal transmission and prevents signal inversion, making this product reliable for data transmission.

Differential Output: YES

Differential output helps in reducing electromagnetic interference and noise, providing cleaner signal transmission over longer distances.

Technical Specifications

Line Drivers & Receivers SN75LVDS84DGGRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6.1 mm

Trade Compliance

SN75LVDS84DGGRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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