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SN75LVDS84DGG

Texas Instruments

SN75LVDS84DGG by Texas Instruments

LINE DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: TSSOP; Package Shape: RECTANGULAR;

Median Price

$4.810

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$4.590

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$4.590

-

-

-

Texas Instruments

USA . 15,505 parts In-Stock

1+ parts

$4.810

100+ parts

$3.921

1k+ parts

$2.614

10k+ parts

-

15,505

$4.810

$3.921

$2.614

-

Mouser Electronics

USA . 221 parts In-Stock

1+ parts

$7.210

100+ parts

$4.980

1k+ parts

$4.240

10k+ parts

-

221

$7.210

$4.980

$4.240

-

Arrow

USA . 160 parts In-Stock

1+ parts

-

100+ parts

$4.951

1k+ parts

$4.063

10k+ parts

$3.970

160

-

$4.951

$4.063

$3.970

Rochester

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$3.840

1k+ parts

$3.430

10k+ parts

$3.230

55

-

$3.840

$3.430

$3.230

DigiKey

USA . 55 parts In-Stock

1+ parts

-

100+ parts

$5.450

1k+ parts

-

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55

-

$5.450

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Avnet

USA . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.602

10k+ parts

$3.503

20

-

-

$3.602

$3.503

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,754 parts In-Stock

1+ parts

$3.448

100+ parts

-

1k+ parts

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10k+ parts

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3,754

$3.448

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Vyrian

USA . 2,051 parts In-Stock

1+ parts

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2,051

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Bristol Electronics

USA . 1,138 parts In-Stock

1+ parts

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1,138

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Chip Stock

USA . 165 parts In-Stock

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ComSIT Distribution GmbH

Germany . 80 parts In-Stock

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80

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,405 parts In-Stock

1+ parts

$3.267

100+ parts

-

1k+ parts

-

10k+ parts

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3,405

$3.267

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Parana Technologies

USA . 1,481 parts In-Stock

1+ parts

$11.216

100+ parts

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1k+ parts

$11.654

10k+ parts

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1,481

$11.216

-

$11.654

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DigiPath Technology Company

USA . 1,661 parts In-Stock

1+ parts

$12.350

100+ parts

$11.362

1k+ parts

-

10k+ parts

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1,661

$12.350

$11.362

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ChromeModa Solutions

Germany . 5,158 parts In-Stock

1+ parts

$12.602

100+ parts

$10.334

1k+ parts

-

10k+ parts

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5,158

$12.602

$10.334

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IDEA Electronic Components Group

UK . 1,509 parts In-Stock

1+ parts

$12.602

100+ parts

$11.972

1k+ parts

$11.342

10k+ parts

-

1,509

$12.602

$11.972

$11.342

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QUARKTWIN TECHNOLOGY LTD

USA . 26,781 parts In-Stock

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26,781

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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5,000

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Lixinc

USA . 2,478 parts In-Stock

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2,478

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Perfect Parts

USA . 1,469 parts In-Stock

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1,469

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iodParts Technologies Inc.

India . 200 parts In-Stock

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Kepictronics

USA . 190 parts In-Stock

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190

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Technical Specifications

Line Drivers & Receivers SN75LVDS84DGG attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

SN75LVDS84DGG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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