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SN75LVDS387DGGRG4

Texas Instruments

SN75LVDS387DGGRG4 by Texas Instruments

SN75LVDS387DGGRG4 by Texas Instruments is a 16-bit line driver with 3.3V power supply, operating temperature of 0-70°C. It features EIA-644/TIA-644 interface standard and differential output, suitable for commercial applications requiring high-speed data transmission in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 13,970 parts In-Stock

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Vyrian

USA . 7,508 parts In-Stock

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7,508

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Digiode

USA . 525 parts In-Stock

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525

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Distributors (Availability)

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Parana Technologies

USA . 1,335 parts In-Stock

1+ parts

$3.780

100+ parts

$351.015

1k+ parts

$3.402

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1,335

$3.780

$351.015

$3.402

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DigiPath Technology Company

USA . 194 parts In-Stock

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$4.162

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$3.829

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194

$4.162

$3.829

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ChromeModa Solutions

Germany . 5,059 parts In-Stock

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$4.247

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$3.483

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5,059

$4.247

$3.483

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IDEA Electronic Components Group

UK . 193 parts In-Stock

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$4.247

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$3.822

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193

$4.247

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$3.822

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AZTECH Wire

Italy . 198 parts In-Stock

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$10.169

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198

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One Stop Electronics

USA . 1,397 parts In-Stock

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$17.500

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1,397

$17.500

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Component Stockers USA

USA . 339 parts In-Stock

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$94.820

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339

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Corphita

USA . 3,095 parts In-Stock

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Microchip USA

USA . 2,694 parts In-Stock

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Overview

Enhance your electronic designs with the SN75LVDS387DGGRG4 by Texas Instruments. Renowned for their top-notch quality and reliability, Texas Instruments delivers cutting-edge solutions for Line Drivers & Receivers. This versatile component offers high performance in a compact package, making it ideal for a wide range of applications. From data transmission to signal processing, this product provides unmatched value, benefits, and advantages to customers looking for superior functionality and seamless integration. Trust Texas Instruments to elevate your projects to the next level with the SN75LVDS387DGGRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability makes installation easy and reduces the overall size of the product, saving valuable space on a PCB.

Maximum Supply Voltage: 3.6 V

High maximum supply voltage allows for flexibility in power supply options, making it compatible with various systems.

No. of Functions: 16

Multiple functions in a single package provide a cost-effective solution for applications requiring various functions.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement on a circuit board, maximizing use of available space.

Maximum Transmit Delay: 2.9 ns

Fast transmit delay ensures quick data transmission, making this product suitable for high-speed applications.

Power Supplies (V): 3.3

Standard power supply voltage simplifies integration into existing systems and ensures compatibility with commonly used voltage levels.

No. of Terminals: 64

Multiple terminals provide ample connection points, allowing for versatile integration and connectivity options.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures reliable connections and reduces the risk of corrosion, enhancing the product's longevity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Line Drivers & Receivers SN75LVDS387DGGRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

16

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-644; TIA-644

JESD-30 Code:

R-PDSO-G64

JESD-609 Code:

e4

Length:

17 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

16

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

.247 V

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP64,.32,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

95 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

2.9 ns

Width:

6.1 mm

Trade Compliance

SN75LVDS387DGGRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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