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SN75LV4737ADB

Texas Instruments

SN75LV4737ADB by Texas Instruments

SN75LV4737ADB by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It features a transmit delay of 850ns and totem-pole output characteristics. Ideal for EIA-232-F, TIA-232-F, V.11 interfaces in commercial-grade applications.

Median Price

$4.007

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,171 parts In-Stock

1+ parts

$2.740

100+ parts

$2.690

1k+ parts

$2.630

10k+ parts

-

5,171

$2.740

$2.690

$2.630

-

Mouser Electronics

USA . 64 parts In-Stock

1+ parts

$9.760

100+ parts

$6.450

1k+ parts

$5.850

10k+ parts

-

64

$9.760

$6.450

$5.850

-

Arrow

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$4.007

1k+ parts

-

10k+ parts

-

50

-

$4.007

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,966 parts In-Stock

1+ parts

$5.880

100+ parts

-

1k+ parts

-

10k+ parts

-

4,966

$5.880

-

-

-

Vyrian

USA . 6,409 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,409

-

-

-

-

Cyclops Electronics Ltd

UK . 20 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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20

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,385 parts In-Stock

1+ parts

$5.571

100+ parts

-

1k+ parts

-

10k+ parts

-

1,385

$5.571

-

-

-

Parana Technologies

USA . 240 parts In-Stock

1+ parts

$5.808

100+ parts

-

1k+ parts

$6.597

10k+ parts

-

240

$5.808

-

$6.597

-

DigiPath Technology Company

USA . 2,177 parts In-Stock

1+ parts

$6.395

100+ parts

$5.884

1k+ parts

-

10k+ parts

-

2,177

$6.395

$5.884

-

-

ChromeModa Solutions

Germany . 2,563 parts In-Stock

1+ parts

$6.526

100+ parts

$5.351

1k+ parts

-

10k+ parts

-

2,563

$6.526

$5.351

-

-

IDEA Electronic Components Group

UK . 2,063 parts In-Stock

1+ parts

$6.526

100+ parts

-

1k+ parts

$5.873

10k+ parts

-

2,063

$6.526

-

$5.873

-

Microchip USA

USA . 1,745 parts In-Stock

1+ parts

$30.660

100+ parts

$30.470

1k+ parts

$30.380

10k+ parts

$30.290

1,745

$30.660

$30.470

$30.380

$30.290

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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10,000

-

-

-

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Perfect Parts

USA . 276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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276

-

-

-

-

Overview

Upgrade your electronic designs with the SN75LV4737ADB by Texas Instruments. This high-quality line driver and receiver offers unmatched performance and reliability, thanks to its cutting-edge technology and superior manufacturing standards. Ideal for a wide range of applications, this product provides seamless communication and optimal signal transmission. Experience the value and benefits of Texas Instruments' expertise with the SN75LV4737ADB - your go-to solution for all your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry.

Surface Mount: YES

Surface mount technology allows for compact and efficient assembly of the product onto a circuit board, saving space and reducing production costs.

Maximum Supply Voltage: 3.6 V

Being able to handle a maximum supply voltage of 3.6V ensures compatibility with a wide range of systems and applications.

No. of Functions: 3

Having multiple functions in one package increases versatility and functionality, making it a cost-effective solution for various applications.

Maximum Transmit Delay: 850 ns

The low transmit delay ensures fast data transmission, making this product suitable for applications that require quick response times.

Power Supplies (V): 3.3/5

Supporting both 3.3V and 5V power supplies allows for flexibility in integration with different systems and devices.

Maximum Output Low Current: 0.001 Amp

The low output current ensures efficient power consumption and minimizes heat dissipation, ideal for energy-efficient designs.

Maximum Receive Delay: 200 ns

A low receive delay ensures quick processing of incoming data, improving overall system performance.

Technical Specifications

Line Drivers & Receivers SN75LV4737ADB attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.11

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

.001 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

200 ns

Receiver No. of Bits:

5

Maximum Seated Height:

2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

20.7 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

850 ns

Width:

5.3 mm

Trade Compliance

SN75LV4737ADB Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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