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SN75LBC182DG4

Texas Instruments

SN75LBC182DG4 by Texas Instruments

SN75LBC182DG4 by Texas Instruments is a Line Driver & Receiver with 5.25V supply voltage, 1300ns transmit delay, and 150ns receive delay. Ideal for EIA-485-A, TIA-485-A, ISO 8482 interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,702 parts In-Stock

1+ parts

-

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1k+ parts

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7,702

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Digiode

USA . 3,783 parts In-Stock

1+ parts

-

100+ parts

-

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3,783

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,609 parts In-Stock

1+ parts

$2.207

100+ parts

-

1k+ parts

$2.715

10k+ parts

-

1,609

$2.207

-

$2.715

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ChromeModa Solutions

Germany . 3,471 parts In-Stock

1+ parts

$2.480

100+ parts

$2.034

1k+ parts

-

10k+ parts

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3,471

$2.480

$2.034

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IDEA Electronic Components Group

UK . 94 parts In-Stock

1+ parts

$2.480

100+ parts

-

1k+ parts

$2.232

10k+ parts

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94

$2.480

-

$2.232

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AZTECH Wire

Italy . 345 parts In-Stock

1+ parts

$18.336

100+ parts

-

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345

$18.336

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One Stop Electronics

USA . 1,266 parts In-Stock

1+ parts

$33.500

100+ parts

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10k+ parts

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1,266

$33.500

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Component Stockers USA

USA . 292 parts In-Stock

1+ parts

$99.990

100+ parts

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292

$99.990

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Corphita

USA . 2,218 parts In-Stock

1+ parts

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2,218

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Microchip USA

USA . 1,162 parts In-Stock

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1,162

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DigiPath Technology Company

USA . 1,016 parts In-Stock

1+ parts

-

100+ parts

$2.236

1k+ parts

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10k+ parts

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1,016

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$2.236

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Overview

Experience high-quality communication with the SN75LBC182DG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a reliable line driver & receiver that is perfect for various applications. This product offers exceptional value, ensuring seamless transmission of data with its differential output and Schmitt trigger input characteristics. Enjoy the benefits of a compact design, wide temperature range, and low power consumption. Upgrade your communication systems today with the SN75LBC182DG4 and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the line driver/receiver, ensuring long-term reliability.

Surface Mount: YES

Makes it easy to integrate into compact electronic designs, saving space on the PCB.

Maximum Supply Voltage: 5.25 V

Allows for a wide operating range and compatibility with various power supply systems.

Package Shape: RECTANGULAR

Facilitates easy placement and alignment on the PCB during assembly.

Maximum Transmit Delay: 1300 ns

Ensures quick transmission of data signals, making the product suitable for high-speed communication applications.

Power Supplies (V): 5

Standard voltage supply for many electronic devices, ensuring compatibility with existing systems.

Technical Specifications

Line Drivers & Receivers SN75LBC182DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00005 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

4 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

150 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

25 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

1300 ns

Width:

3.9 mm

Trade Compliance

SN75LBC182DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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