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SN75LBC180ADG4

Texas Instruments

SN75LBC180ADG4 by Texas Instruments

SN75LBC180ADG4 by Texas Instruments is a Line Driver & Receiver with 5V supply, 12ns max transmit delay, and 20ns max receive delay. Ideal for EIA-485-A, TIA-485-A, ISO 8482 interfaces in commercial temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,010 parts In-Stock

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7,010

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Digiode

USA . 4,841 parts In-Stock

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4,841

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Chip Stock

USA . 655 parts In-Stock

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655

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,169 parts In-Stock

1+ parts

$11.435

100+ parts

$1,061.887

1k+ parts

$10.291

10k+ parts

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2,169

$11.435

$1,061.887

$10.291

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DigiPath Technology Company

USA . 2,300 parts In-Stock

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$12.591

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2,300

$12.591

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ChromeModa Solutions

Germany . 2,317 parts In-Stock

1+ parts

$12.848

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$10.535

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2,317

$12.848

$10.535

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IDEA Electronic Components Group

UK . 1,749 parts In-Stock

1+ parts

$12.848

100+ parts

$12.206

1k+ parts

$11.563

10k+ parts

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1,749

$12.848

$12.206

$11.563

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AZTECH Wire

Italy . 350 parts In-Stock

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$15.467

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350

$15.467

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One Stop Electronics

USA . 386 parts In-Stock

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$38.500

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386

$38.500

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Corphita

USA . 384 parts In-Stock

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384

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Microchip USA

USA . 228 parts In-Stock

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Perfect Parts

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Overview

Unlock seamless communication with the SN75LBC180ADG4 by Texas Instruments, a top-tier manufacturer known for cutting-edge technology. As a leading player in the Line Drivers & Receivers category, this product offers unparalleled quality and reliability. Ideal for applications requiring differential output characteristics, this small outline package delivers exceptional performance in a variety of settings. Trust Texas Instruments to provide innovative solutions that enhance connectivity and streamline operations, making your projects more efficient and effective.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight, durable, and resistant to environmental factors, ensuring a longer lifespan.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of systems and applications, providing flexibility in usage.

Maximum Transmit Delay: 12 ns

The low transmit delay ensures fast and efficient data transmission, making the product suitable for high-speed communication.

Output Characteristics: DIFFERENTIAL

The differential output provides better noise immunity and signal integrity, making the product reliable in noisy environments.

Technology: BICMOS

The BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance, low power consumption, and improved reliability.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Compliance with industry interface standards ensures compatibility with a wide range of systems and devices, allowing for easy integration and interoperability.

Technical Specifications

Line Drivers & Receivers SN75LBC180ADG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.1 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

12 ns

Width:

3.9 mm

Trade Compliance

SN75LBC180ADG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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