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SN75LBC179ADRG4

Texas Instruments

SN75LBC179ADRG4 by Texas Instruments

SN75LBC179ADRG4 by Texas Instruments is a Line Driver & Receiver with 5V supply voltage, 12ns transmit delay, and 20ns receive delay. It is used in EIA-485-A, TIA-485-A, ISO 8482 interface standards for differential communication applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,206 parts In-Stock

1+ parts

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8,206

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Digiode

USA . 3,414 parts In-Stock

1+ parts

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3,414

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Nova Conductors

Japan . 16 parts In-Stock

1+ parts

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16

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 808 parts In-Stock

1+ parts

$1.500

100+ parts

-

1k+ parts

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808

$1.500

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Parana Technologies

USA . 1,951 parts In-Stock

1+ parts

$9.165

100+ parts

-

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$9.813

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1,951

$9.165

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$9.813

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DigiPath Technology Company

USA . 1,513 parts In-Stock

1+ parts

$10.092

100+ parts

$9.285

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1,513

$10.092

$9.285

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IDEA Electronic Components Group

UK . 2,040 parts In-Stock

1+ parts

$10.298

100+ parts

$9.783

1k+ parts

$9.268

10k+ parts

-

2,040

$10.298

$9.783

$9.268

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ChromeModa Solutions

Germany . 1,863 parts In-Stock

1+ parts

$10.298

100+ parts

$8.444

1k+ parts

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1,863

$10.298

$8.444

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AZTECH Wire

Italy . 350 parts In-Stock

1+ parts

$17.891

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350

$17.891

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One Stop Electronics

USA . 570 parts In-Stock

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$47.500

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570

$47.500

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A-Z Elektronik GmbH

Germany . 5,080 parts In-Stock

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5,080

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Corphita

USA . 2,583 parts In-Stock

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2,583

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Microchip USA

USA . 2,212 parts In-Stock

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2,212

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Aranea Global

USA . 2,000 parts In-Stock

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Overview

Elevate your communication systems with the SN75LBC179ADRG4 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable Line Drivers & Receivers that are essential in various applications. This small outline package offers a range of benefits, from its high-performance differential output to its low power consumption. With a maximum operable temperature of 70°C and a peak reflow temperature of 260°C, this line transceiver guarantees durability and efficiency. Upgrade your technology with the SN75LBC179ADRG4 and experience seamless connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

Enables easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Provides a wide operating range for compatibility with different power sources.

Package Shape: RECTANGULAR

Allows for efficient utilization of board space and easy integration into existing designs.

Maximum Transmit Delay: 12 ns

Ensures fast and accurate data transmission, making it ideal for high-speed applications.

Power Supplies (V): 5

Operates on a common voltage, simplifying power management in systems.

No. of Terminals: 8

Sufficient terminals for versatile connectivity options, enhancing flexibility in usage.

Package Style (Meter): SMALL OUTLINE

Compact design for space-constrained applications without compromising performance.

Minimum Supply Voltage-1: 4.75 V

Provides a reliable operating range, ensuring stable functionality under varying conditions.

Maximum High Level Input Current: 0.0001 Amp

Low input current requirement for efficient power consumption, reducing overall system energy usage.

Maximum Operating Temperature: 70 °C

Withstands high temperatures, allowing for reliable operation in harsh environments.

Output Characteristics: DIFFERENTIAL

Differential output for noise immunity and improved signal integrity, suitable for long-distance communication.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold environments without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides corrosion resistance and ensures lasting connectivity for long-term use.

Terminal Position: DUAL

Dual terminal placement for enhanced stability and secure connections.

Maximum Seated Height: 1.75 mm

Low-profile design for compact installations in space-limited applications.

Width: 3.9 mm

Slim width for efficient board space utilization, ideal for compact system designs.

Maximum Output Low Current: 8 Amp

High output current capacity for driving external loads, suitable for various applications.

Output Polarity: COMPLEMENTARY

Complementary output signals for balanced signal transmission, reducing interference and improving reliability.

Differential Output: YES

Differential outputs for noise immunity and signal integrity in noisy environments, ensuring reliable data transmission.

Peak Reflow Temperature °C: 260

Withstands high temperatures during assembly processes, ensuring component integrity.

Length: 4.9 mm

Compact length for space-efficient placement on circuit boards, suitable for compact designs.

Minimum Out Swing: 1.1 V

Low swing voltage for efficient power consumption, reducing energy usage in operation.

Temperature Grade: COMMERCIAL

Commercial-grade temperature tolerance for reliable performance in standard operating conditions.

Maximum Receive Delay: 20 ns

Quick receive delay for timely data reception and processing, suitable for real-time applications.

Technology: BICMOS

Utilizes BiCMOS technology, offering a balance of performance and efficiency for optimal operation.

Terminal Form: GULL WING

Gull wing terminals for secure soldering and reliable connections, ensuring long-term performance.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482

Conforms to industry standards for compatibility and interoperability with other devices.

Maximum Supply Current: 15 mA

Low supply current requirement, reducing power consumption and improving energy efficiency.

Input Characteristics: DIFFERENTIAL SCHMITT TRIGGER

Differential Schmitt trigger inputs for noise immunity and reliable signal detection, suitable for challenging environments.

Nominal Supply Voltage: 5 V

Standard nominal voltage for universal compatibility in various systems.

Terminal Pitch: 1.27 mm

Standard terminal pitch for easy integration into existing circuit designs and board layouts.

Nominal Supply Voltage-1: 5 V

Consistent supply voltage for stable operation and performance reliability.

Interface IC Type: LINE TRANSCEIVER

Line transceiver interface IC type for efficient data communication and signal conversion.

Technical Specifications

Line Drivers & Receivers SN75LBC179ADRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.1 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

20 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

12 ns

Width:

3.9 mm

Trade Compliance

SN75LBC179ADRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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