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SN75HVD3082EDRG4

Texas Instruments

SN75HVD3082EDRG4 by Texas Instruments

SN75HVD3082EDRG4 by Texas Instruments is a Line Driver & Receiver with 5.5V max supply voltage, 1300ns max transmit delay, and 8 terminals. It operates differentially at temperatures from 0 to 70°C, suitable for EIA-485-A/TIA-485-A interfaces in commercial-grade applications.

Median Price

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Lifecycle Status

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5

In-Stock Inventory

1k+

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Chip Stock

USA . 44,170 parts In-Stock

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Digiode

USA . 2,706 parts In-Stock

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Vyrian

USA . 2,334 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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Parana Technologies

USA . 79 parts In-Stock

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$4.600

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$5.063

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79

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ChromeModa Solutions

Germany . 1,553 parts In-Stock

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$5.168

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$4.238

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IDEA Electronic Components Group

UK . 60 parts In-Stock

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$5.168

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$4.651

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Corohmni

South Africa . 222 parts In-Stock

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$5.987

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AZTECH Wire

Italy . 490 parts In-Stock

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$9.275

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One Stop Electronics

USA . 749 parts In-Stock

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$13.500

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Ampacity Inc.

Singapore . 668 parts In-Stock

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A-Z Elektronik GmbH

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Continental Prestige Electronics

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Corphita

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Argo Parts USA

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Microchip USA

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Perfect Parts

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DigiPath Technology Company

USA . 1,832 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Enhance your communication network with the SN75HVD3082EDRG4 by Texas Instruments. Designed for reliability and efficiency, this line driver & receiver offers seamless transmission of data in various applications. With a maximum supply voltage of 5.5V and a compact rectangular package style, this product ensures high performance and durability. Trust Texas Instruments' expertise in semiconductor manufacturing to deliver top-quality products like the SN75HVD3082EDRG4 that provide exceptional value, benefits, and advantages to customers seeking reliable communication solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and longevity of the product, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, increasing its versatility.

Maximum Transmit Delay: 1300 ns

The low transmit delay ensures fast and efficient data transmission, making this product ideal for high-speed applications.

Output Characteristics: DIFFERENTIAL

The differential output allows for noise rejection and improved signal integrity, making this product suitable for applications where data accuracy is crucial.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can reliably function in a wide range of environmental conditions.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption and high noise immunity, making it energy-efficient and reliable.

Technical Specifications

Line Drivers & Receivers SN75HVD3082EDRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

DIFFERENTIAL

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

200 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

.9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

1300 ns

Width:

3.9 mm

Trade Compliance

SN75HVD3082EDRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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