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SN75HVD08DG4

Texas Instruments

SN75HVD08DG4 by Texas Instruments

SN75HVD08DG4 by Texas Instruments is a Line Driver & Receiver with 5.5V max supply voltage, 40ns max transmit delay, and 8A max output low current. Ideal for EIA-485-A, TIA-485-A, ISO 8482E interfaces in commercial temperature grade applications requiring BICMOS technology.

Median Price

$6.590

Lifecycle Status

EOL

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 110 parts In-Stock

1+ parts

$6.590

100+ parts

$4.580

1k+ parts

$4.120

10k+ parts

$3.170

110

$6.590

$4.580

$4.120

$3.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.860

-

-

-

Digiode

USA . 3,597 parts In-Stock

1+ parts

$6.260

100+ parts

-

1k+ parts

-

10k+ parts

-

3,597

$6.260

-

-

-

Vyrian

USA . 2,958 parts In-Stock

1+ parts

-

100+ parts

-

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2,958

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-

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LIBRA Elektronik GmbH

Germany . 85 parts In-Stock

1+ parts

-

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85

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,337 parts In-Stock

1+ parts

$3.860

100+ parts

-

1k+ parts

-

10k+ parts

$3.783

3,337

$3.860

-

-

$3.783

Argo Parts USA

USA . 1,565 parts In-Stock

1+ parts

$3.860

100+ parts

-

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10k+ parts

-

1,565

$3.860

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-

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$3.860

100+ parts

$3.783

1k+ parts

-

10k+ parts

-

1,000

$3.860

$3.783

-

-

Ampacity Inc.

Singapore . 110 parts In-Stock

1+ parts

$5.600

100+ parts

-

1k+ parts

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10k+ parts

-

110

$5.600

-

-

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Corphita

USA . 4,536 parts In-Stock

1+ parts

$5.931

100+ parts

-

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4,536

$5.931

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Corohmni

South Africa . 46 parts In-Stock

1+ parts

$9.698

100+ parts

-

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46

$9.698

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Parana Technologies

USA . 569 parts In-Stock

1+ parts

$13.129

100+ parts

-

1k+ parts

$13.632

10k+ parts

-

569

$13.129

-

$13.632

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DigiPath Technology Company

USA . 936 parts In-Stock

1+ parts

$14.457

100+ parts

-

1k+ parts

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936

$14.457

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ChromeModa Solutions

Germany . 4,956 parts In-Stock

1+ parts

$14.752

100+ parts

$12.097

1k+ parts

-

10k+ parts

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4,956

$14.752

$12.097

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IDEA Electronic Components Group

UK . 1,203 parts In-Stock

1+ parts

$14.752

100+ parts

$14.014

1k+ parts

$13.277

10k+ parts

-

1,203

$14.752

$14.014

$13.277

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AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$16.012

100+ parts

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627

$16.012

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QUARKTWIN TECHNOLOGY LTD

USA . 9,768 parts In-Stock

1+ parts

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9,768

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Microchip USA

USA . 7,501 parts In-Stock

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7,501

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Overview

Upgrade your communication systems with the SN75HVD08DG4 by Texas Instruments. This top-of-the-line line driver and receiver is designed for reliability and performance, perfect for a wide range of applications. From industrial automation to automotive systems, this product offers seamless integration and high-quality signal transmission. Trust in Texas Instruments' reputation for excellence and experience the value and benefits that the SN75HVD08DG4 brings to your projects. Elevate your technology with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring reliable performance in various environments.

Surface Mount: YES

Allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 5.5 V

Supports a wide operating voltage range, making it versatile for different power supply configurations.

Package Shape: RECTANGULAR

Facilitates standard PCB layout and placement, enabling straightforward integration into existing designs.

Maximum Transmit Delay: 40 ns

Ensures fast and efficient data transmission, critical for applications requiring real-time communication.

Power Supplies (V): 3.3/5

Compatible with common power supply voltages, offering flexibility in system integration.

No. of Terminals: 8

Provides sufficient I/O connections for interfacing with other devices or components in the system.

Terminal Position: DUAL

Allows for versatile mounting orientations and configurations, accommodating a variety of PCB layouts.

Maximum Output Low Current: 8 Amp

Capable of driving high-current loads, making it suitable for applications requiring robust signal transmission capabilities.

Differential Output: YES

Supports differential signaling, which enhances noise immunity and signal integrity in high-noise environments.

Technical Specifications

Line Drivers & Receivers SN75HVD08DG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.0001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482E

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

70 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

16 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

3 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

40 ns

Width:

3.9 mm

Trade Compliance

SN75HVD08DG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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