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SN75HVD05DRG4

Texas Instruments

SN75HVD05DRG4 by Texas Instruments

SN75HVD05DRG4 by Texas Instruments is a Line Driver & Receiver with 5V supply, 11ns max transmit delay, and 25ns max receive delay. Ideal for EIA-485-A, TIA-485-A, ISO 8482E interfaces in commercial temperature applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,633 parts In-Stock

1+ parts

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6,633

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Digiode

USA . 2,196 parts In-Stock

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2,196

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 387 parts In-Stock

1+ parts

$8.378

100+ parts

-

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387

$8.378

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Parana Technologies

USA . 1,612 parts In-Stock

1+ parts

$12.162

100+ parts

-

1k+ parts

$12.576

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1,612

$12.162

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$12.576

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DigiPath Technology Company

USA . 151 parts In-Stock

1+ parts

$13.392

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151

$13.392

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ChromeModa Solutions

Germany . 5,567 parts In-Stock

1+ parts

$13.665

100+ parts

$11.205

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5,567

$13.665

$11.205

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IDEA Electronic Components Group

UK . 2,251 parts In-Stock

1+ parts

$13.665

100+ parts

$12.982

1k+ parts

$12.298

10k+ parts

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2,251

$13.665

$12.982

$12.298

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One Stop Electronics

USA . 944 parts In-Stock

1+ parts

$39.500

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944

$39.500

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Microchip USA

USA . 3,276 parts In-Stock

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3,276

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Corphita

USA . 610 parts In-Stock

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610

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Overview

Unlock seamless communication and reliable data transmission with the SN75HVD05DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality line drivers & receivers that meet the highest standards of performance and durability. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers seeking efficient and effective solutions. Experience enhanced connectivity and peace of mind knowing you have a trusted and innovative product at your disposal.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, making the product long-lasting.

Maximum Supply Voltage: 5.5 V

Allows for compatibility with a wide range of power supplies, increasing flexibility in usage.

Maximum Transmit Delay: 11 ns

Ensures fast and efficient data transmission, suitable for high-speed applications.

No. of Terminals: 8

Provides multiple connection options and versatility in setups.

Minimum Operating Temperature: 0 °C

Can operate in a wide range of temperature conditions, making it suitable for various environments.

Maximum Seated Height: 1.75 mm

Compact design allows for space-saving installation in tight spaces.

Differential Output: YES

Enhances signal quality and noise immunity, ensuring reliable data transmission.

Temperature Grade: COMMERCIAL

Can be used in commercial applications without any performance issues.

Interface Standard: EIA-485-A; TIA-485-A; ISO 8482E

Compliant with industry standards for communication interfaces, ensuring compatibility with other devices.

Nominal Supply Voltage: 5 V

Stable supply voltage ensures consistent performance and reliability.

Technical Specifications

Line Drivers & Receivers SN75HVD05DRG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

SIGNALING RATE UPTO 40 MBPS

Differential Output:

YES

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-485-A; TIA-485-A; ISO 8482E

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2.5 V

Maximum Output Low Current:

8 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

25 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

11 ns

Width:

3.9 mm

Trade Compliance

SN75HVD05DRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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