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SN75C3243PW

Texas Instruments

SN75C3243PW by Texas Instruments

SN75C3243PW by Texas Instruments is a Line Driver & Receiver with 3 functions, operating at 3.6V max supply voltage. It features a small outline package style and Schmitt trigger input characteristics, suitable for EIA-232 interface applications. With a peak reflow temperature of 260°C, it offers inverted output polarity and dual terminal position for commercial-grade operations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,206 parts In-Stock

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8,206

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Digiode

USA . 3,719 parts In-Stock

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3,719

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Component Sense

UK . 34 parts In-Stock

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34

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Distributors (Availability)

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Parana Technologies

USA . 655 parts In-Stock

1+ parts

$5.477

100+ parts

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$6.205

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655

$5.477

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$6.205

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DigiPath Technology Company

USA . 1,420 parts In-Stock

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$6.031

100+ parts

$5.548

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1,420

$6.031

$5.548

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ChromeModa Solutions

Germany . 4,502 parts In-Stock

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$6.154

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$5.046

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4,502

$6.154

$5.046

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IDEA Electronic Components Group

UK . 2,318 parts In-Stock

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$6.154

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$5.539

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2,318

$6.154

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$5.539

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AZTECH Wire

Italy . 748 parts In-Stock

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$7.063

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748

$7.063

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Microchip USA

USA . 2,720 parts In-Stock

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$15.383

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$15.383

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One Stop Electronics

USA . 359 parts In-Stock

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$19.500

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359

$19.500

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A-Z Elektronik GmbH

Germany . 7,278 parts In-Stock

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Corphita

USA . 3,847 parts In-Stock

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Kepictronics

USA . 450 parts In-Stock

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Overview

Enhance your communication systems with the SN75C3243PW by Texas Instruments, a reliable and high-quality line driver & receiver. With a commitment to excellence, Texas Instruments delivers top-notch products that meet and exceed industry standards. This versatile component is perfect for a wide range of applications, offering customers unmatched value, performance, and reliability. Upgrade your systems today and experience the benefits of Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to impact, making it suitable for rugged industrial environments.

Surface Mount: YES

Surface mount design simplifies the installation process and saves space on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle a relatively high supply voltage, providing flexibility in power source selection.

No. of Functions: 3

Having multiple functions in one component reduces the overall number of components needed in a circuit, saving space and simplifying design.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board.

Power Supplies (V): 3.3/5

Can accommodate different power supply voltage options, providing versatility in circuit design.

No. of Terminals: 28

Having a high number of terminals allows for connectivity to multiple components, enabling complex circuit configurations.

Minimum Operating Temperature: 0 °C

Capable of operating at low temperatures, making it suitable for use in diverse environments.

Maximum Output Low Current: 1.6 Amp

High output current capability allows for driving power-hungry components in the circuit.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring reliable operation.

Interface Standard: EIA-232

Meets industry-standard interface specifications, ensuring compatibility with a wide range of equipment.

Technical Specifications

Line Drivers & Receivers SN75C3243PW attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

3

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

3

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

5

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

3.6 V

Minimum Supply Voltage-1:

3 V

Nominal Supply Voltage-1:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN75C3243PW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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