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SN75C3223EDWG4

Texas Instruments

SN75C3223EDWG4 by Texas Instruments

SN75C3223EDWG4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 3.3/5V. It features EIA-232-F, TIA-232-F, V.28 interface standard and Schmitt trigger input characteristics. Ideal for commercial applications requiring bipolar technology and peak reflow temperature of 260°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,035 parts In-Stock

1+ parts

-

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5,035

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Digiode

USA . 4,545 parts In-Stock

1+ parts

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4,545

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 535 parts In-Stock

1+ parts

$12.109

100+ parts

$1,124.536

1k+ parts

$10.898

10k+ parts

-

535

$12.109

$1,124.536

$10.898

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DigiPath Technology Company

USA . 909 parts In-Stock

1+ parts

$13.334

100+ parts

-

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909

$13.334

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ChromeModa Solutions

Germany . 2,543 parts In-Stock

1+ parts

$13.606

100+ parts

$11.157

1k+ parts

-

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2,543

$13.606

$11.157

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IDEA Electronic Components Group

UK . 1,625 parts In-Stock

1+ parts

$13.606

100+ parts

$12.926

1k+ parts

$12.245

10k+ parts

-

1,625

$13.606

$12.926

$12.245

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AZTECH Wire

Italy . 576 parts In-Stock

1+ parts

$13.672

100+ parts

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576

$13.672

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Ampacity Inc.

Singapore . 315 parts In-Stock

1+ parts

$23.500

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315

$23.500

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One Stop Electronics

USA . 1,155 parts In-Stock

1+ parts

$36.500

100+ parts

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1,155

$36.500

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Component Stockers USA

USA . 752 parts In-Stock

1+ parts

$99.990

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752

$99.990

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Corphita

USA . 856 parts In-Stock

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856

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Microchip USA

USA . 282 parts In-Stock

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282

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Overview

Unlock seamless communication with the SN75C3223EDWG4 by Texas Instruments. Crafted with precision and expertise, this line driver & receiver offers unrivaled quality and reliability. Perfect for a wide range of applications, this product provides exceptional value and benefits to customers seeking efficient and dependable performance. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the SN75C3223EDWG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easy installation and efficient use of space on a circuit board.

Maximum Supply Voltage: 3.6 V

Can handle a maximum supply voltage of 3.6V, making it suitable for a variety of applications.

No. of Functions: 2

Offers 2 functions in one component, providing value and cost-effectiveness.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate into circuit designs.

Power Supplies (V): 3.3/5

Can work with power supplies of 3.3V or 5V, offering flexibility in design.

No. of Terminals: 20

With 20 terminals, it allows for multiple connections and versatile use.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and is suitable for compact designs.

Maximum High Level Input Current: 0.000001 Amp

Efficiently handles high level input current, ensuring stable operation.

Minimum Supply Voltage: 3 V

Works efficiently with a minimum supply voltage of 3V.

Technical Specifications

Line Drivers & Receivers SN75C3223EDWG4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Differential Output:

NO

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-232-F; TIA-232-F; V.28

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

10 V

Maximum Output Low Current:

1.6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Receiver No. of Bits:

2

Maximum Seated Height:

2.65 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

1 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN75C3223EDWG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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