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SN75C1168PWRE4

Texas Instruments

SN75C1168PWRE4 by Texas Instruments

SN75C1168PWRE4 by Texas Instruments is a Line Driver & Receiver with 2 functions, operating at 5V. It features a max transmit delay of 12ns and differential output. Ideal for EIA-422-B, TIA-422-B, V.11 interfaces in commercial temperature applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 19,500 parts In-Stock

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19,500

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Digiode

USA . 4,456 parts In-Stock

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4,456

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Vyrian

USA . 2,181 parts In-Stock

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2,181

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Ampacity Inc.

Singapore . 241 parts In-Stock

1+ parts

$0.500

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-

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241

$0.500

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AZTECH Wire

Italy . 712 parts In-Stock

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$5.387

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712

$5.387

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Parana Technologies

USA . 343 parts In-Stock

1+ parts

$6.398

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$7.147

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343

$6.398

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$7.147

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DigiPath Technology Company

USA . 1,580 parts In-Stock

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$7.045

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1,580

$7.045

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ChromeModa Solutions

Germany . 4,909 parts In-Stock

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$7.189

100+ parts

$5.895

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4,909

$7.189

$5.895

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IDEA Electronic Components Group

UK . 1,902 parts In-Stock

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$7.189

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$6.470

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$7.189

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$6.470

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One Stop Electronics

USA . 628 parts In-Stock

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$9.500

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$9.500

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Corohmni

South Africa . 118 parts In-Stock

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$9.963

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$14.893

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$14.148

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$14.148

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50

$14.893

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$14.148

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Semicontronic

India . 387 parts In-Stock

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$37.500

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$36.562

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$36.375

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387

$37.500

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Argo Parts USA

USA . 4,089 parts In-Stock

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Continental Prestige Electronics

USA . 3,874 parts In-Stock

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Corphita

USA . 2,961 parts In-Stock

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Microchip USA

USA . 1,713 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 20 parts In-Stock

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Overview

Unlock a world of seamless communication with the SN75C1168PWRE4 by Texas Instruments. Crafted with precision and expertise, this Line Driver & Receiver offers unparalleled quality and reliability. Whether you're in need of robust data transmission or high-speed signaling, this versatile component delivers. Perfect for a wide range of applications, from industrial automation to telecommunications, this product boasts exceptional value, efficiency, and performance. Stay ahead of the curve with Texas Instruments and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 5.5 V

A high maximum supply voltage of 5.5 V ensures compatibility with a wide range of systems and power sources.

No. of Functions: 2

Having multiple functions in a single device simplifies the design and implementation of electronic circuits.

Maximum Transmit Delay: 12 ns

The low transmit delay of 12 ns ensures fast and efficient data transmission in high-speed communication systems.

Power Supplies (V): 5

Operating at a standard power supply voltage of 5 V makes it compatible with most electronic devices and systems.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0°C ensures reliable performance in various environmental conditions.

Maximum Output Low Current: 6 Amp

The high maximum output low current of 6 Amp enables driving of larger loads or long transmission lines without signal degradation.

Technology: BICMOS

The use of Bipolar-CMOS (BiCMOS) technology offers a combination of high-speed performance and low power consumption, making it an efficient choice for line drivers and receivers.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliance with industry-standard interface standards ensures compatibility and interoperability with a wide range of communication protocols and systems.

Technical Specifications

Line Drivers & Receivers SN75C1168PWRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

RECEIVER 3-STATE OUTPUTS

Differential Output:

YES

Driver No. of Bits:

2

Maximum High Level Input Current:

.000001 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

6 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

27 ns

Receiver No. of Bits:

2

Maximum Seated Height:

1.2 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

12 ns

Width:

4.4 mm

Trade Compliance

SN75C1168PWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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