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SN75ALS176ADRE4

Texas Instruments

SN75ALS176ADRE4 by Texas Instruments

SN75ALS176ADRE4 by Texas Instruments is a Line Driver & Receiver with 8 terminals, operating at 5V. It features a max transmit delay of 11.5ns and differential output interface for applications requiring EIA-422-B, TIA-422-B, EIA-485-A standards in commercial temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,505 parts In-Stock

1+ parts

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7,505

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Digiode

USA . 3,507 parts In-Stock

1+ parts

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3,507

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,037 parts In-Stock

1+ parts

$8.905

100+ parts

-

1k+ parts

$9.579

10k+ parts

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2,037

$8.905

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$9.579

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DigiPath Technology Company

USA . 819 parts In-Stock

1+ parts

$9.806

100+ parts

$9.021

1k+ parts

-

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819

$9.806

$9.021

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ChromeModa Solutions

Germany . 3,783 parts In-Stock

1+ parts

$10.006

100+ parts

$8.205

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3,783

$10.006

$8.205

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IDEA Electronic Components Group

UK . 2,187 parts In-Stock

1+ parts

$10.006

100+ parts

$9.506

1k+ parts

$9.005

10k+ parts

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2,187

$10.006

$9.506

$9.005

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AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$15.953

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218

$15.953

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Ampacity Inc.

Singapore . 1,440 parts In-Stock

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$24.500

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1,440

$24.500

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One Stop Electronics

USA . 1,379 parts In-Stock

1+ parts

$39.500

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1,379

$39.500

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Microchip USA

USA . 2,439 parts In-Stock

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2,439

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Corphita

USA . 1,980 parts In-Stock

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1,980

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the unparalleled quality and reliability of the SN75ALS176ADRE4 by Texas Instruments, a leading manufacturer in the industry. This line driver & receiver offers exceptional performance and versatility for a wide range of applications. With its innovative design and cutting-edge technology, this product ensures seamless communication and efficient signal transmission. Experience the value and benefits of Texas Instruments' expertise with the SN75ALS176ADRE4, providing customers with a competitive edge in their projects. Trust in the advantages that this product brings to enhance your systems and achieve outstanding results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight is a concern and durability is important.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and power sources.

Package Shape: RECTANGULAR

The rectangular package shape is standard and easy to work with in most circuit board designs.

Maximum Transmit Delay: 11.5 ns

The low transmit delay ensures fast and efficient data transmission, making it suitable for high-speed communication applications.

Power Supplies (V): 5

The 5V power supply requirement is a common standard in many electronic devices, making integration easier.

No. of Terminals: 8

Having 8 terminals allows for connection to multiple input and output devices, increasing flexibility in system design.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps to save space on the circuit board, making it suitable for compact electronic devices.

Maximum High Level Input Current: 0.00002 Amp

The low input current requirement helps to minimize power consumption and heat generation, making the product energy-efficient.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance when not actively transmitting data, reducing signal interference and improving overall signal quality.

Minimum Operating Temperature: 0 °C

The wide operating temperature range from 0°C ensures reliable performance in various environmental conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Width: 3.9 mm

The compact width of 3.9mm helps to save space on the circuit board, making it suitable for small electronic devices.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies signal processing and interpretation, enhancing system reliability.

Differential Output: YES

The differential output helps to improve signal integrity by reducing common-mode noise and interference, ensuring robust data transmission.

Technical Specifications

Line Drivers & Receivers SN75ALS176ADRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

3-STATE DRIVER OUTPUT AND RECEIVER INPUT

Differential Output:

YES

Driver No. of Bits:

1

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; EIA-485-A; TIA-485-A; V.11; X.27

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

1.5 V

Output Characteristics:

3-STATE

Maximum Output Low Current:

8 Amp

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

18 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Transmit Delay:

11.5 ns

Width:

3.9 mm

Trade Compliance

SN75ALS176ADRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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