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SN75477DRE4

Texas Instruments

SN75477DRE4 by Texas Instruments

SN75477DRE4 by Texas Instruments is a peripheral driver with 2 functions, operating at 5V. It has built-in transient protection and can handle up to 0.5A output current. Ideal for applications requiring inverted output polarity and standard input characteristics in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,102 parts In-Stock

1+ parts

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9,102

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Digiode

USA . 2,819 parts In-Stock

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2,819

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 577 parts In-Stock

1+ parts

$3.828

100+ parts

-

1k+ parts

$4.315

10k+ parts

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577

$3.828

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$4.315

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DigiPath Technology Company

USA . 233 parts In-Stock

1+ parts

$4.215

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233

$4.215

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IDEA Electronic Components Group

UK . 1,122 parts In-Stock

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$4.301

100+ parts

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$3.871

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1,122

$4.301

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$3.871

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ChromeModa Solutions

Germany . 491 parts In-Stock

1+ parts

$4.301

100+ parts

$3.527

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491

$4.301

$3.527

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$14.426

100+ parts

$13.128

1k+ parts

$11.829

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40

$14.426

$13.128

$11.829

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AZTECH Wire

Italy . 451 parts In-Stock

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$17.715

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451

$17.715

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One Stop Electronics

USA . 301 parts In-Stock

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$35.500

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301

$35.500

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Corphita

USA . 1,458 parts In-Stock

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Microchip USA

USA . 1,441 parts In-Stock

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Overview

Enhance your electronic projects with the SN75477DRE4 from Texas Instruments, a top-tier manufacturer known for quality and innovation. This peripheral driver offers reliable performance and built-in protections, making it ideal for a wide range of applications. With a maximum supply voltage of 5.5V and a peak output current of 0.5A, this small outline package delivers exceptional value and efficiency. Trust Texas Instruments to provide cutting-edge technology that meets your needs with precision and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.5 V

With a higher maximum supply voltage, this peripheral driver can handle a wider range of input voltages, making it versatile for different applications.

Built-in Protections: TRANSIENT

The inclusion of transient protections helps safeguard the peripheral driver and connected devices from sudden voltage spikes or fluctuations, enhancing overall reliability.

Output Characteristics: OPEN-COLLECTOR

The open-collector output allows for easy interfacing with external circuitry, providing flexibility in the design and integration of the peripheral driver.

Maximum Output Current: 0.5 A

With a relatively high maximum output current, this peripheral driver can drive more demanding loads, making it suitable for various applications that require higher current capabilities.

Turn-on Time: 0.35 us

The fast turn-on time ensures quick response and operation of the peripheral driver, making it suitable for time-critical applications where rapid switching is required.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy surface mounting and soldering onto circuit boards, simplifying the manufacturing process and enhancing overall product reliability.

Technical Specifications

Peripheral Drivers SN75477DRE4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

TRANSIENT

Driver No. of Bits:

2

Input Characteristics:

STANDARD

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-COLLECTOR

Output Current Flow Direction:

SINK

Maximum Output Current:

.5 A

Nominal Output Peak Current Limit:

.5 A

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

75 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Turn-off Time:

.35 us

Turn-on Time:

.35 us

Width:

3.9 mm

Trade Compliance

SN75477DRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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