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SN75182N

Texas Instruments

SN75182N by Texas Instruments

SN75182N by Texas Instruments is a Line Driver & Receiver with 2 functions. It operates at 5V, has a max supply voltage of 5.5V, and features a totem-pole output characteristic. Ideal for applications requiring line reception with a commercial temperature grade up to 70°C.

Median Price

$3.010

Lifecycle Status

Suppliers In-Stock

52

In-Stock Inventory

1k+

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Bürklin Elektronik

Germany . 475 parts In-Stock

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Chip1Stop

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Mouser Electronics

USA . 364 parts In-Stock

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DigiKey

USA . 485 parts In-Stock

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RS (Exports)

UK . 65 parts In-Stock

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Rochester

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Arrow

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Verical

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Digiode

USA . 2,526 parts In-Stock

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TEDSS.com

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American Microsemiconductor Inc.

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Forefront Electronics and Design

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DigiKey Marketplace

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First Choice Components Inc.

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Mentor Electronics Marketing, LLC

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Corphita

USA . 1,430 parts In-Stock

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$1.548

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Parana Technologies

USA . 1,945 parts In-Stock

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$4.182

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$4.623

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DigiPath Technology Company

USA . 124 parts In-Stock

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$4.605

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ChromeModa Solutions

Germany . 1,624 parts In-Stock

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$4.699

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$3.853

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IDEA Electronic Components Group

UK . 786 parts In-Stock

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$4.699

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$4.229

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Microchip USA

USA . 107 parts In-Stock

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$11.960

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$11.890

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$11.850

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$11.810

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$11.810

Authorized Procurement Solutions

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Overview

Enhance your electronic projects with the SN75182N by Texas Instruments, a top-quality Line Driver & Receiver that offers unparalleled performance and reliability. Manufactured by a trusted industry leader, this innovative product features advanced technology and a durable design made of high-grade materials. With versatile applications in various electronic systems, this component ensures seamless data transmission and enhanced signal integrity. Trust in Texas Instruments to deliver exceptional value and functionality with the SN75182N, setting a new standard for excellence in the field of interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides sturdy and durable packaging for the internal components, ensuring product longevity.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of input voltages, increasing compatibility with various systems.

No. of Functions: 2

Offers dual functionality in a single component, potentially saving on space and cost.

Maximum Operating Temperature: 70 °C

Can operate effectively in high-temperature environments, enhancing reliability.

Output Polarity: TRUE

Ensures accurate and consistent output signals, crucial for data transmission.

Technical Specifications

Line Drivers & Receivers SN75182N attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Additional Features:

BUILT-IN LINE TERMINATION; RESPONSE CONTROL

Differential Output:

NO

Maximum High Level Input Current:

.000005 Amp

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.305 mm

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

TOTEM-POLE

Maximum Output Low Current:

16 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

45 ns

Receiver No. of Bits:

2

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

28 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN75182N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-536-5900, 5962015365900

NIIN

015365900

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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