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SN75160BDWRE4

Texas Instruments

SN75160BDWRE4 by Texas Instruments

SN75160BDWRE4 by Texas Instruments is a Line Driver & Receiver with 8 functions, operating at 5.25V max supply voltage. It features a transmit delay of 20ns and receive delay of 22ns, suitable for applications requiring IEEE-488 interface standard in commercial temperature grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,062 parts In-Stock

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Chip Stock

USA . 3,300 parts In-Stock

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3,300

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Digiode

USA . 630 parts In-Stock

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630

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Ampacity Inc.

Singapore . 1,539 parts In-Stock

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$2.500

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$2.500

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Corohmni

South Africa . 209 parts In-Stock

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$3.043

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Parana Technologies

USA . 1,962 parts In-Stock

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$10.330

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$10.850

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$10.330

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$10.850

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DigiPath Technology Company

USA . 493 parts In-Stock

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$11.375

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$10.465

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493

$11.375

$10.465

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ChromeModa Solutions

Germany . 6,453 parts In-Stock

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$11.607

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$9.518

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$9.518

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IDEA Electronic Components Group

UK . 1,149 parts In-Stock

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$11.607

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$11.027

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$10.446

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$11.027

$10.446

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AZTECH Wire

Italy . 450 parts In-Stock

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$13.010

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One Stop Electronics

USA . 628 parts In-Stock

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Semicontronic

India . 142 parts In-Stock

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$30.500

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$29.738

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$29.585

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142

$30.500

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iodParts Technologies Inc.

India . 9,268 parts In-Stock

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Continental Prestige Electronics

USA . 4,758 parts In-Stock

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Kepictronics

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Microchip USA

USA . 1,270 parts In-Stock

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Corphita

USA . 466 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Experience seamless data transmission with the SN75160BDWRE4 by Texas Instruments, a top-of-the-line Line Driver & Receiver. Crafted with precision and expertise by Texas Instruments, this versatile product offers unmatched quality and reliability. Ideal for a wide range of applications, this innovative device ensures smooth and efficient signal transfer. Elevate your projects with the SN75160BDWRE4 and enjoy the exceptional value, benefits, and advantages it brings to the table. Trust Texas Instruments for cutting-edge technology that delivers results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and reliability, making the product suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving design, making it ideal for compact electronics.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, the product can handle power variations and ensure stable operation.

No. of Functions: 8

Having 8 functions in one product offers versatility and functionality for different signal processing needs.

Maximum Transmit Delay: 20 ns

The low transmit delay ensures fast signal transmission, reducing latency in the system.

Maximum Operating Temperature: 70 °C

Being able to operate at high temperatures makes the product suitable for industrial environments where heat may be a concern.

Technology: BIPOLAR

Bipolar technology provides high-speed and high-frequency performance, making it ideal for applications requiring quick signal processing.

Interface Standard: IEEE-488

Compliance with the IEEE-488 interface standard ensures compatibility with a wide range of devices and systems using this communication protocol.

Technical Specifications

Line Drivers & Receivers SN75160BDWRE4 attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

NO

Driver No. of Bits:

8

Maximum High Level Input Current:

.00002 Amp

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

IEEE-488

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

8

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Low Current:

48000 Amp

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Receive Delay:

22 ns

Receiver No. of Bits:

8

Maximum Seated Height:

2.65 mm

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Transmit Delay:

20 ns

Width:

7.5 mm

Trade Compliance

SN75160BDWRE4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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