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SN74LVC1G66DRLRG4

Texas Instruments

SN74LVC1G66DRLRG4 by Texas Instruments

SN74LVC1G66DRLRG4 by Texas Instruments is a SPST switch with 5 terminals, operating at 1.65-5.5V and -40 to 85°C. It has a max on-state resistance of 20 ohm, switching time of 6.5 ns, and nominal bandwidth of 300 kHz. Ideal for industrial applications requiring fast signal switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 185,500 parts In-Stock

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185,500

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Vyrian

USA . 6,430 parts In-Stock

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6,430

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Digiode

USA . 3,207 parts In-Stock

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3,207

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Distributors (Availability)

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Semicontronic

India . 1,436 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

10k+ parts

-

1,436

$2.500

$2.438

$2.425

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Ampacity Inc.

Singapore . 1,079 parts In-Stock

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$3.500

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1,079

$3.500

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One Stop Electronics

USA . 844 parts In-Stock

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$5.500

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844

$5.500

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AZTECH Wire

Italy . 631 parts In-Stock

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$7.533

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631

$7.533

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Parana Technologies

USA . 1,459 parts In-Stock

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$15.757

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$16.116

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1,459

$15.757

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$16.116

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DigiPath Technology Company

USA . 1,562 parts In-Stock

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$17.350

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1,562

$17.350

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IDEA Electronic Components Group

UK . 2,148 parts In-Stock

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$17.704

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$16.819

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$15.934

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2,148

$17.704

$16.819

$15.934

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ChromeModa Solutions

Germany . 2,134 parts In-Stock

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$17.704

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$14.517

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$17.704

$14.517

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Corphita

USA . 2,270 parts In-Stock

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2,270

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Microchip USA

USA . 2,220 parts In-Stock

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Corohmni

South Africa . 323 parts In-Stock

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Overview

Enhance your electronic design projects with the SN74LVC1G66DRLRG4 by Texas Instruments, a high-quality SPST switch that offers reliable performance and precise functionality. With Texas Instruments' reputation for excellence in manufacturing, this multiplexer guarantees superior quality and durability. Ideal for various applications, this small-outline, very thin profile switch provides customers with seamless operation and efficient control over their circuits. Experience the value and benefits of this innovative product, ensuring smooth signal transmission and optimal performance in industrial-grade environments. Upgrade your designs today with the SN74LVC1G66DRLRG4 and discover the difference that Texas Instruments brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and cost-effectiveness, making this product a reliable choice for long-term use.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement allows for efficient power consumption and operation at lower voltages, ideal for energy-saving applications.

Maximum On-state Resistance (Ron): 20 ohm

With a low on-state resistance, this product offers minimal signal loss and efficient signal transmission, ensuring high performance and accuracy.

Maximum Switch-on Time: 6.5 ns

The fast switch-on time ensures quick and responsive switching capabilities, making this product suitable for high-speed applications where rapid signal routing is required.

Technology: CMOS

The CMOS technology used in this product offers low power consumption, high noise immunity, and fast switching speeds, making it a reliable and efficient choice for various electronic systems.

Technical Specifications

Multiplexers & Switches SN74LVC1G66DRLRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

300 kHz

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e4

Length:

1.6 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Nominal Off-state Isolation:

42 dB

Nominal On-state Resistance Match:

12 ohm

Maximum On-state Resistance (Ron):

20 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

FL5,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Maximum Signal Current:

.1 A

Maximum Supply Current (Isup):

.01 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

6.9 ns

Maximum Switch-on Time:

6.5 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

FLAT

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.2 mm

Trade Compliance

SN74LVC1G66DRLRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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