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SN74LVC157AQDRQ1

Texas Instruments

SN74LVC157AQDRQ1 by Texas Instruments

SN74LVC157AQDRQ1 by Texas Instruments is a 4-function multiplexer with 2 inputs and propagation delay of 5.4 ns at 3.3V. Designed for automotive applications, it operates b/w -40 to 125 °C with a small outline package style and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,580 parts In-Stock

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Digiode

USA . 4,190 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 892 parts In-Stock

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$6.215

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892

$6.215

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Parana Technologies

USA . 1,132 parts In-Stock

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$22.768

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$23.432

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DigiPath Technology Company

USA . 596 parts In-Stock

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$25.070

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596

$25.070

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ChromeModa Solutions

Germany . 6,478 parts In-Stock

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$25.582

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$20.977

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$20.977

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IDEA Electronic Components Group

UK . 2,160 parts In-Stock

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$25.582

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$24.303

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$23.024

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$25.582

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$23.024

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One Stop Electronics

USA . 801 parts In-Stock

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$36.000

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801

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QUARKTWIN TECHNOLOGY LTD

USA . 10,157 parts In-Stock

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Corphita

USA . 2,420 parts In-Stock

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Microchip USA

USA . 112 parts In-Stock

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Overview

Upgrade your automotive electronics with the high-quality SN74LVC157AQDRQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like this multiplexer & demultiplexer that are perfect for a wide range of applications. With fast propagation delay, low power consumption, and excellent reliability, this component offers exceptional value to customers looking for efficient and dependable solutions. Trust Texas Instruments to provide cutting-edge technology that enhances performance and functionality in automotive systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 5.4 ns

Ensures fast signal processing and high-speed data transmission.

Surface Mount: YES

Allows for easy installation on a printed circuit board, saving space and simplifying assembly.

No. of Functions: 4

Provides versatility and flexibility in signal routing and processing.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance under harsh environmental conditions.

Nominal Supply Voltage / Vsup (V): 2.7

Works efficiently within a low voltage range, making it suitable for various applications.

Load Capacitance (CL): 50 pF

Optimized for handling a specific capacitance for improved signal integrity.

Power Supplies (V): 3.3

Compatible with standard power supply voltages, ensuring easy integration into existing systems.

No. of Terminals: 16

Provides multiple connection points for interfacing with other electronic components.

Maximum I (ol): 24 Amp

Can handle high current loads for reliable and efficient operation.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold environments without compromising performance.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity.

Technical Specifications

Multiplexer & Demultiplexer SN74LVC157AQDRQ1 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

6.2 ns

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.7

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN74LVC157AQDRQ1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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