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SN74LV165ANS

Texas Instruments

SN74LV165ANS by Texas Instruments

SN74LV165ANS by Texas Instruments is an 8-bit digital shift register with a propagation delay of 26 ns and a max frequency of 50 MHz. It operates at a nominal voltage of 2.5V, making it suitable for industrial applications requiring fast data shifting in compact spaces. The device features positive edge triggering and complementary output polarity, ideal for high-speed signal processing in temperature-sensitive environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,399 parts In-Stock

1+ parts

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3,399

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Digiode

USA . 1,097 parts In-Stock

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1,097

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Distributors (Availability)

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AZTECH Wire

Italy . 814 parts In-Stock

1+ parts

$14.412

100+ parts

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814

$14.412

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One Stop Electronics

USA . 1,092 parts In-Stock

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$17.000

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$17.000

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Parana Technologies

USA . 1,163 parts In-Stock

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$18.797

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$18.885

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1,163

$18.797

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$18.885

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DigiPath Technology Company

USA . 553 parts In-Stock

1+ parts

$20.698

100+ parts

$19.042

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553

$20.698

$19.042

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ChromeModa Solutions

Germany . 3,671 parts In-Stock

1+ parts

$21.120

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$17.318

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3,671

$21.120

$17.318

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IDEA Electronic Components Group

UK . 868 parts In-Stock

1+ parts

$21.120

100+ parts

$20.064

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$19.008

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868

$21.120

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$19.008

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Corphita

USA . 3,630 parts In-Stock

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Microchip USA

USA . 2,871 parts In-Stock

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Overview

Unlock the potential of your digital designs with the SN74LV165ANS by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their products. The SN74LV165ANS is a high-performance 8-bit digital shift register that offers fast propagation delay and a wide operating temperature range, making it ideal for industrial applications. With its compact size and robust design, this shift register provides unmatched value and efficiency to customers looking to optimize their electronic systems. Upgrade your projects today with the SN74LV165ANS and experience the benefits of Texas Instruments innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and cost-effectiveness.

Surface Mount: YES

Allows for easy and efficient installation on printed circuit boards.

No. of Bits: 8

Provides enough storage capacity for various digital operations.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a low voltage, making it energy efficient.

Propagation Delay (tpd): 26 ns

Delivers fast signal processing for quick response times.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions.

Maximum Frequency At Nominal Supply: 50000000 Hz

Supports high-frequency operations for demanding applications.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor technology ensures low power consumption and high noise immunity.

Technical Specifications

Digital Shift Registers SN74LV165ANS attributes and parameters. Explore more Digital Shift Registers devices from Texas Instruments

Specs

Count Direction:

RIGHT

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Maximum Frequency At Nominal Supply:

50000000 Hz

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay (tpd):

26 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Shift Registers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

5.3 mm

Minimum fmax:

90 MHz

Trade Compliance

SN74LV165ANS Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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